tda8026 NXP Semiconductors, tda8026 Datasheet - Page 53

• Manufacturer Part Number: tda8026
• Description: Multiple Smart Card Slot Interface Ic
• Manufacturer: NXP Semiconductors

NXP Semiconductors
15. Abbreviations
16. Revision history
Table 52.
[1]
TDA8026_1
Product data sheet
Document ID
TDA8026_1
Versions 1.0 to 1.2 have all been superseded by this version which includes changes to symbols, pin names and drawings.
Revision history
For further information on temperature profiles, refer to Application Note AN10365
“Surface mount reflow soldering description” .
Table 51.
Acronym
ATR
CDM
ESD
ESR
HBM
LSB
MM
MSB
PCB
POR
POS
SAM
Fig 16. Temperature profiles for large and small components
Release date
20100309
temperature
MSL: Moisture Sensitivity Level
Abbreviations and acronyms
All information provided in this document is subject to legal disclaimers.
Description
Answer To Request
Charged Device Model
ElectroStatic Discharge
Equivalent Series Resistance
Human Body Model
Least Significant Bit
Machine Model
Most Significant Bit
Printed-Circuit Board
Power-On Reset
Point Of Sales
Security Access Module
Data sheet status
Product data sheet
Rev. 1 — 9 March 2010
= minimum soldering temperature
maximum peak temperature
minimum peak temperature
= MSL limit, damage level
Change notice
-
Multiple smart card slot interface IC
temperature
Supersedes
1.2
peak
TDA8026
© NXP B.V. 2010. All rights reserved.
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time
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