ds42585 Advanced Micro Devices, ds42585 Datasheet - Page 7

• Manufacturer Part Number: ds42585
• Description: Stacked Multi-chip Package Mcp Flash Memory And Sram
• Manufacturer: Advanced Micro Devices

CONNECTION DIAGRAM
Special Handling Instructions for FBGA
Package
Special handling is required for Flash Memory prod-
ucts in FBGA packages.
M1
C1
G1
A1
B1
F1
NC
NC
NC
NC
NC
L1
NC
NC
CE1#s
CE#f
D2
G2
H2
E2
F2
J2
A3
A2
A1
A0
DQ0
DQ8
OE#
V
C3
D3
G3
H3
A7
E3
F3
K3
J3
A6
A5
A4
SS
DQ10
DQ1
DQ9
DQ2
UB#
LB#
A18
A17
C4
D4
G4
H4
E4
F4
K4
J4
WP#/ACC
RESET#
RY/BY#
DQ11
DQ3
V
C5
H5
B5
D5
NC
E5
J5
L5
NC
K5
CC
f
P R E L I M I N A R Y
CE2s
V
CIOs
WE#
DQ4
D6
A20
C6
H6
B6
E6
K6
NC
J6
L6
NC
CC
73-Ball FBGA
s
DS42585
DQ13
DQ12
DQ6
DQ5
A19
A10
C7
D7
G7
H7
E7
F7
K7
A8
A9
J7
Flash memory devices in FBGA packages may be
damaged if exposed to ultrasonic cleaning methods.
The package and/or data integrity may be compro-
mised if the package body is exposed to temperatures
above 150 C for prolonged periods of time.
DQ15/A-1
DQ14
A11
DQ7
A12
A13
A14
C8
D8
G8
H8
E8
F8
K8
SA
J8
CIOf
A15
A16
V
D9
G9
H9
E9
F9
NC
NC
J9
SS
G10
M10
A10
B10
F10
L10
NC
NC
NC
NC
NC
NC
SRAM only
Shared
Flash only
7