upd78f0134hgka1-9et-a Renesas Electronics Corporation., upd78f0134hgka1-9et-a Datasheet - Page 516

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upd78f0134hgka1-9et-a

Manufacturer Part Number
upd78f0134hgka1-9et-a
Description
8-bit Single-chip Microcontrollers
Manufacturer
Renesas Electronics Corporation.
Datasheet
(2)
Note After opening the dry pack, store it at 25 C or less and 65% RH or less for the allowable storage period.
Caution Do not use different soldering methods together (except for partial heating).
516
Infrared reflow
VPS
Wave soldering
Partial heating
Soldering Method
78F0133HGC(A)-8BS, 78F0133HGC(A1)-8BS, 78F0134HGC-8BS, 78F0134HGC(A)-8BS,
78F0134HGC(A1)-8BS, 78F0136HGC-8BS, 78F0136HGC(A)-8BS, 78F0136HGC(A1)-8BS,
78F0138HGC-8BS, 78F0138HGC(A)-8BS, 78F0138HGC(A1)-8BS
PD78F0132HGC-8BS, 78F0132HGC(A)-8BS, 78F0132HGC(A1)-8BS, 78F0133HGC-8BS,
Package peak temperature: 235 C, Time: 30 seconds max. (at 210 C or higher),
Count: 3 times or less, Exposure limit: 7 days
20 to 72 hours)
Solder bath temperature: 260 C max., Time: 10 seconds max., Count: Once,
Preheating temperature: 120 C max. (package surface temperature), Exposure
limit: 7 days
Pin temperature: 350 C max., Time: 3 seconds max. (per pin row)
Package peak temperature: 215 C, Time: 40 seconds max. (at 200 C or higher),
Count: 3 times or less, Exposure limit: 7 days
20 to 72 hours)
Table 32-1. Surface Mounting Type Soldering Conditions (2/3)
CHAPTER 32 RECOMMENDED SOLDERING CONDITIONS
Note
(after that, prebake at 125 C for 20 to 72 hours)
User’s Manual U16899EJ3V0UD
Soldering Conditions
Note
Note
(after that, prebake at 125 C for
(after that, prebake at 125 C for
IR35-207-3
VP15-207-3
WS60-207-1
Condition Symbol
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