gt3200 SMC Corporation, gt3200 Datasheet - Page 50

• Manufacturer Part Number: gt3200
• Description: Usb2.0 Phy Ic
• Manufacturer: SMC Corporation

Revision 1.3 (10-05-04)
Figure 9.3 USB3250-ABZJ (lead free) 56 Pin QFN Package Outline, 8x8x0.85mm Body
A1
A2
D1
D2
E1
E2
D
A
E
L
3
Maximum mold protrusion is 0.25 mm per side.
4
5
Package body dimensions D1 and E1 do not include the mold protrusion.
Dimension for foot length L measured at the gauge plane 0.25 mm above the seating plane.
Details of pin 1 identifier are optional but must be located within the zone indicated.
Table 9.3 USB3250-ABZJ (lead free) 56 Pin QFN Package Parameters
0.70
7.85
7.55
2.25
7.85
7.55
2.25
0.30
MIN
0
~
NOMINAL
0.02
8.00
8.00
~
~
~
~
~
~
~
DATASHEET
45
MAX
1.00
0.05
0.80
8.15
7.95
6.80
8.15
7.95
6.80
0.50
Standoff
X Mold Cap Size
Y Mold Cap Size
Terminal Length
Overall Package Height
Mold Thickness
X Overall Size
X exposed Pad Size
Y Overall Size
Y exposed Pad Size
SMSC GT3200, SMSC USB3250
REMARKS
USB2.0 PHY IC