gt3200 SMC Corporation, gt3200 Datasheet - Page 12

• Manufacturer Part Number: gt3200
• Description: Usb2.0 Phy Ic
• Manufacturer: SMC Corporation

Revision 1.3 (10-05-04)
DP
DM
RBIAS
XI/XO
VDD3.3
VDD1.8
VSS
VDDA3.3
VDDA1.8
VSSA
NAME
NAME
NAME
Note 4.1
Note 4.2
DIRECTION
DIRECTION
DIRECTION
Input
Input
N/A
N/A
N/A
N/A
N/A
N/A
I/O
I/O
A Ferrite Bead (with DC resistance <.5 Ohms) is recommended for filtering between both
the VDD3.3 and VDDA3.3 supplies and the VDD1.8 and VDDA1.8 Supplies. See
Figure 8.9 Application Diagram for 64-pin TQFP Package on page
56-pin QFN package will down-bond all VSS and VSSA to exposed pad under IC.
Exposed pad must be connected to solid GND plane on printed circuit board.
Table 4.4 Biasing and Clock Oscillator Signals
ACTIVE
ACTIVE
Table 4.5 Power and Ground Signals
LEVEL
LEVEL
ACTIVE
LEVEL
N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A
N/A
Table 4.3 USB I/O Signals
3.3V Digital Supply. Powers digital pads. See
1.8V Digital Supply. Powers digital core.
Digital Ground. See
3.3V Analog Supply. Powers analog I/O and 3.3V analog
circuitry.
1.8V Analog Supply. Powers 1.8V analog circuitry. See
Analog Ground. See
External 1% bias resistor. Requires a 12K
Used for setting HS transmit current level and on-chip termination
impedance.
External crystal. 12MHz crystal connected from XI to XO.
DATASHEET
USB Positive Data Pin.
USB Negative Data Pin.
7
Note 4.2
Note 4.2
DESCRIPTION
DESCRIPTION
DESCRIPTION
SMSC GT3200, SMSC USB3250
40.
resistor to ground.
Note 4.1
USB2.0 PHY IC
Note 4.1