psmn1r1-30bl NXP Semiconductors, psmn1r1-30bl Datasheet - Page 3

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psmn1r1-30bl

Manufacturer Part Number
psmn1r1-30bl
Description
Psmn1r1-30bl N-channel 30 V 1.1 M?? Logic Level Mosfet In D2pak
Manufacturer
NXP Semiconductors
Datasheet
NXP Semiconductors
4. Limiting values
Table 4.
In accordance with the Absolute Maximum Rating System (IEC 60134).
[1]
PSMN1R1-30BL
Objective data sheet
Symbol
V
V
V
I
I
P
T
T
T
Source-drain diode
I
I
Avalanche ruggedness
E
D
DM
S
SM
Fig 1.
stg
j
sld(M)
DS
DGR
GS
tot
DS(AL)S
(A)
Continuous current is limited by package.
I
D
420
360
300
240
180
120
60
0
mounting base temperature.
Continuous drain current as a function of
0
Limiting values
Parameter
drain-source voltage
drain-gate voltage
gate-source voltage
drain current
peak drain current
total power dissipation
storage temperature
junction temperature
peak soldering temperature
source current
peak source current
non-repetitive drain-source
avalanche energy
50
(1)
100
150
All information provided in this document is subject to legal disclaimers.
T
003aaf774
mb
( ° C)
200
Rev. 1 — 3 February 2011
Conditions
T
T
V
V
pulsed; t
see
T
T
pulsed; t
V
V
j
j
mb
mb
GS
GS
GS
sup
≥ 25 °C; T
≥ 25 °C; T
Figure 3
= 25 °C; see
= 25 °C
= 10 V; T
= 10 V; T
= 10 V; T
≤ 30 V; R
p
p
≤ 10 µs; T
≤ 10 µs; T
N-channel 30 V 1.1 mΩ logic level MOSFET in D2PAK
j
j
Fig 2.
≤ 175 °C
≤ 175 °C; R
mb
mb
j(init)
GS
= 100 °C; see
= 25 °C; see
= 50 Ω; unclamped
P
Figure 2
(%)
= 25 °C; I
der
120
80
40
mb
mb
0
function of mounting base temperature
Normalized total power dissipation as a
0
= 25 °C;
= 25 °C
GS
D
= 20 kΩ
= 120 A;
Figure 1
Figure 1
50
PSMN1R1-30BL
[1]
[1]
[1]
100
Min
-
-
-20
-
-
-
-
-55
-55
-
-
-
-
150
© NXP B.V. 2011. All rights reserved.
T
mb
175
175
260
Max
30
30
20
120
120
1456
306
120
1456
1.9
03aa16
(°C)
200
Unit
V
V
V
A
A
A
W
°C
°C
°C
A
A
J
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