NC7SP74K8X Fairchild Semiconductor, NC7SP74K8X Datasheet

IC FLIP FLOP ULP D-TYPE US8

NC7SP74K8X

Manufacturer Part Number
NC7SP74K8X
Description
IC FLIP FLOP ULP D-TYPE US8
Manufacturer
Fairchild Semiconductor
Series
7SPr
Type
D-Typer
Datasheet

Specifications of NC7SP74K8X

Function
Set(Preset) and Reset
Output Type
Differential
Number Of Elements
1
Number Of Bits Per Element
1
Frequency - Clock
40MHz
Delay Time - Propagation
24ns
Trigger Type
Positive Edge
Current - Output High, Low
2.6mA, 2.6mA
Voltage - Supply
0.9 V ~ 3.6 V
Operating Temperature
-40°C ~ 85°C
Mounting Type
Surface Mount
Package / Case
US8, 8-VSSOP
Number Of Circuits
1
Logic Family
7S
Logic Type
D-Type Flip-Flop
Polarity
Inverting/Non-Inverting
Input Type
Single-Ended
Propagation Delay Time
27 ns
High Level Output Current
- 2.6 mA
Low Level Output Current
2.6 mA
Supply Voltage (max)
3.6 V
Maximum Operating Temperature
+ 85 C
Mounting Style
SMD/SMT
Minimum Operating Temperature
- 40 C
Supply Voltage (min)
0.9 V
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Other names
NC7SP74K8X
NC7SP74K8XTR

Available stocks

Company
Part Number
Manufacturer
Quantity
Price
Part Number:
NC7SP74K8X
Manufacturer:
FAIRCHILD/仙童
Quantity:
20 000
Company:
Part Number:
NC7SP74K8X
Quantity:
4 500
This is to inform you that a design and/or process change will be made to the following
product(s). This notification is for your information and concurrence.
If you require data or samples to qualify this change, please contact Fairchild Semiconductor
within 30 days of receipt of this notification.
Updated process quality documentation, such as FMEAs and Control Plans, are available for
viewing upon request.
If you have any questions concerning this change, please contact:
PCN Originator:
Name: Leng, HooiChin
E-mail: HooiChin.Leng@notes.fairchildsemi.com
Phone: 604-8502370
Implementation of change:
Expected 1st Device Shipment Date: 2009/01/01
Earliest Year/Work Week of Changed Product: 0836
Change Type Description: Mold Compound
Description of Change (From): VSOP package assembly at all FSC approved manufacturing
locations using non Green mold compound, Nitto MP-8000AN.
Description of Change (To): VSOP package assembly at all FSC approved manufacturing
locations using Green mold compound, Sumitomo G600.
Reason for Change : Green initiative by Fairchild Semiconductor. Fairchild Semiconductor is
dedicated to being a good corporate citizen. All Fairchild Semiconductor products are 2nd level
interconnect lead-free and RoHS compliance. The referenced material changes have been made
to provide a Full Green (Halogen Free Flame Retardant) package. For additional details on the
corporate wide green initiative please visit our Web site at :
http://www.fairchildsemi.com/company/green/index.html Manufacturing will occur at the same
assembly facilities producing the current non-green products. Package outline drawings of the
VSOP package remain un-changed. Green products will be fully compliant to all published data
sheet specifications and will be interchangeable with current non-green product. Quality and
reliability will remain at the highest standards already demonstrated with Fairchild's existing
products.
Qual/REL Plan Numbers : Q20070506
Qualification :
Attached are the Reliability Test results to qualify the Green conversion of the VSOP
package assembled at Hana-Ayutthaya.
DESIGN/PROCESS CHANGE NOTIFICATION -- FINAL
Technical Contact:
Name: Po, Peter
E-mail: Peter.Po@notes.fairchildsemi.com
Phone: 604-8502267
Date Issued On : 2008/08/27
Date Created : 2008/08/05
PCN# : Q1080802-A
Pg. 1

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NC7SP74K8X Summary of contents

Page 1

... This is to inform you that a design and/or process change will be made to the following product(s). This notification is for your information and concurrence. If you require data or samples to qualify this change, please contact Fairchild Semiconductor within 30 days of receipt of this notification. Updated process quality documentation, such as FMEAs and Control Plans, are available for viewing upon request ...

Page 2

Change From Change To Results/Discussion for Qual Plan NumberQ20070506 Test: (Gate Leakage Negative) Lot Device Q20070506AAGATE- GTLP2T152K8X Q20070506ABGATE- GTLP2T152K8X Q20070506BAGATE- FSUSB31K8X Q20070506CAGATE- FSA1259K8X Q20070506CBGATE- FSA1259K8X Q20070506CCGATE- FSA1259K8X Test: (Gate Leakage Positive) Lot Device Q20070506AAGATE+ GTLP2T152K8X Q20070506ABGATE+ GTLP2T152K8X Q20070506BAGATE+ FSUSB31K8X Q20070506CAGATE+ ...

Page 3

... Product Id Description : This change notification covers Fairchild Semiconductor?s VSOP 8-Lead package assembled at Hana. Please refer to the affected FSID listing below for specific part numbers. Affected FSIDs : FIN1017K8X FIN1101K8X FSUSB31K8X GTLP2T152K8X NC7NP34K8X NC7NZ17K8X NC7SP74K8X NC7WB3125K8X NC7WBD3306K8X NC7WP08K8X NC7WP32K8X NC7WZ00K8X NC7WZ125K8X NC7WZ240K8X NC7WZ38K8X 0/77 ...

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