PBSS8110X Philips Semiconductors, PBSS8110X Datasheet - Page 12

no-image

PBSS8110X

Manufacturer Part Number
PBSS8110X
Description
NPN low VCEsat (BISS) transistor
Manufacturer
Philips Semiconductors
Datasheet

Available stocks

Company
Part Number
Manufacturer
Quantity
Price
Part Number:
PBSS8110X
Manufacturer:
NXP/恩智浦
Quantity:
20 000
Philips Semiconductors
11. Soldering
12. Mounting
9397 750 14956
Product data sheet
Fig 19. Reflow soldering footprint SOT89 (SC-62/TO-243)
Fig 20. FR4 PCB, standard footprint
4.60
mm
40
0.85
Reflow soldering is the only recommended soldering method.
Dimensions in mm
3.96 mm
1.20
1.20
1.00
(3x)
0.20
0.5 mm
2.5 mm
2.5 mm
1 mm
32 mm
Rev. 01 — 11 May 2005
3
3 mm
1 mm
001aaa234
1.6 mm
1.20
3.70
3.95
4.75
2.25
2.00
1.90
2
5 mm
100 V, 1 A NPN low V
Fig 21. FR4 PCB, mounting pad for
1
0.60 (3x)
mm
0.70 (3x)
40
0.50
collector 6 cm
3.96 mm
1.20
1.70
0.5 mm
2.5 mm
© Koninklijke Philips Electronics N.V. 2005. All rights reserved.
4.85
msa442
32 mm
30 mm
PBSS8110X
CEsat
2
001aaa235
1 mm
(BISS) transistor
1.6 mm
solder lands
solder resist
occupied area
solder paste
mm
20
5 mm
12 of 15

Related parts for PBSS8110X