BUK456-60A Philips Semiconductors, BUK456-60A Datasheet

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... PIN CONFIGURATION tab CONDITIONS MIN ˚ 100 ˚ ˚ ˚ CONDITIONS 1 Product Specification BUK456-60A/B MAX. MAX. UNIT -60A -60B 150 150 175 175 0.028 0.03 SYMBOL MAX. UNIT - ...

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... Measured from drain lead 6 mm from package to centre of die Measured from source lead 6 mm from package to source bond pad CONDITIONS - - -dI /dt = 100 Product Specification BUK456-60A/B MIN. TYP. MAX. UNIT 2.1 3.0 4 0.1 1 100 ...

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... Fig.5. Typical output characteristics BUK456-60 0.20 0. 100 us 0. 0.05 100 ms 0.00 100 = 25 ˚C Fig.6. Typical on-state resistance Product Specification BUK456-60A/B Zth j-mb / (K/W) BUKx56- 0.5 0.2 0.1 0.05 0. 1E-05 1E-03 1E- Fig.4. Transient thermal impedance f(t); parameter ...

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... 10000 1000 100 10 100 140 180 Fig.12. Typical capacitances f Product Specification BUK456-60A/B VGS(TO max. typ. min. - 100 140 Fig.10. Gate threshold voltage. = f(T ); conditions mA SUB-THRESHOLD CONDUCTION 2 % typ ...

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... Fig.13. Typical turn-on gate-charge characteristics f(Q ); conditions parameter April 1993 BUK456- 100 Fig.14. Typical reverse diode current f SDS 5 Product Specification BUK456-60A/B BUK456-50A 150 VSDS / V ); conditions parameter T GS Rev 1.100 2 j ...

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... Observe the general handling precautions for electrostatic-discharge sensitive devices (ESDs) to prevent damage to MOS gate oxide. 2. Refer to mounting instructions for TO220 envelopes. 3. Epoxy meets UL94 V0 at 1/8". April 1993 10,3 max 3,7 2,8 3,0 13,5 min 1 0,9 max (3x) 2,54 2,54 Fig.15. TO220AB; pin 2 connected to mounting base. 6 Product Specification BUK456-60A/B 4,5 max 1,3 5,9 min 15,8 max 0,6 2,4 Rev 1.100 ...

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... Philips customers using or selling these products for use in such applications their own risk and agree to fully indemnify Philips for any damages resulting from such improper use or sale. April 1993 7 Product Specification BUK456-60A/B Rev 1.100 ...