BUK456-800A Philips Semiconductors, BUK456-800A Datasheet

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... PIN CONFIGURATION tab CONDITIONS MIN ˚ 100 ˚ ˚ ˚ CONDITIONS 1 Product Specification BUK456-800A/B MAX. MAX. UNIT -800A -800B 800 800 4 3.5 125 125 3 4 SYMBOL MAX. UNIT - 800 V - 800 -800A ...

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... Measured from drain lead 6 mm from package to centre of die Measured from source lead 6 mm from package to source bond pad CONDITIONS - - 4.0 A; -dI /dt = 100 100 Product Specification BUK456-800A/B MIN. TYP. MAX. UNIT 800 - - V 2.1 3.0 4 0.1 1 100 ...

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... Fig.5. Typical output characteristics BUK456-800A 100 100 ms 0 1000 = 25 ˚C Fig.6. Typical on-state resistance Product Specification BUK456-800A/B Zth j-mb / (K/W) BUKx56- 0.5 0.2 0.1 0.05 0. 1E-05 1E-03 1E- Fig.4. Transient thermal impedance. ...

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... f 10000 1000 100 10 80 100 120 140 Fig.12. Typical capacitances f Product Specification BUK456-800A/B VGS(TO max. typ. min. -40 - 100 120 140 Fig.10. Gate threshold voltage. = f(T ); conditions mA ...

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... Fig.13. Typical turn-on gate-charge characteristics f(Q ); conditions parameter May 1995 BUK4y6-800 150 640 Fig.14. Typical reverse diode current f SDS 5 Product Specification BUK456-800A/B BUK4y6-800A 25 1 VSDS / V ); conditions parameter T GS Rev 1.200 2 j ...

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... Observe the general handling precautions for electrostatic-discharge sensitive devices (ESDs) to prevent damage to MOS gate oxide. 2. Refer to mounting instructions for TO220 envelopes. 3. Epoxy meets UL94 V0 at 1/8". May 1995 10,3 max 3,7 2,8 3,0 13,5 min 1 0,9 max (3x) 2,54 2,54 Fig.15. TO220AB; pin 2 connected to mounting base. 6 Product Specification BUK456-800A/B 4,5 max 1,3 5,9 min 15,8 max 0,6 2,4 Rev 1.200 ...

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... Philips customers using or selling these products for use in such applications their own risk and agree to fully indemnify Philips for any damages resulting from such improper use or sale. May 1995 7 Product Specification BUK456-800A/B Rev 1.200 ...