DSP56F801 Motorola Inc, DSP56F801 Datasheet - Page 42

• Manufacturer Part Number: DSP56F801
• Description: 56F801 16-bit Hybrid Controller
• Manufacturer: Motorola Inc

Please see www.freescale.com for the most current case outline.
42
B
B1
9
AB
AC
T
12
1
4X
SECTION AE-AE
0.080
4X
0.200 AC T-U
48
13
S1
0.200 AB T-U
M
BASE METAL
A1
F
D
AC
G
A
S
T-U
Figure 4-2 48-pin LQFP Mechanical Information
N
Z
Z
AD
Z
Z
J
CASE 932-03
37
24
ISSUE F
36
25
U
56F801 Technical Data, Rev. 16
V1
0.080 AC
DETAIL Y
V
C
H
E
DETAIL AD
TOP & BOTTOM
DETAIL Y
M °
AE
W
P
T, U, Z
AE
AA
K
NOTES:
1.
2.
3.
4.
5.
6.
7.
8.
9.
DIMENSIONING AND TOLERANCING PER
ASME Y14.5M, 1994.
CONTROLLING DIMENSION: MILLIMETER.
DATUM PLANE AB IS LOCATED AT BOTTOM
OF LEAD AND IS COINCIDENT WITH THE
LEAD WHERE THE LEAD EXITS THE PLASTIC
BODY AT THE BOTTOM OF THE PARTING
LINE.
DATUMS T, U, AND Z TO BE DETERMINED AT
DATUM PLANE AB.
DIMENSIONS S AND V TO BE DETERMINED
AT SEATING PLANE AC.
DIMENSIONS A AND B DO NOT INCLUDE
MOLD PROTRUSION. ALLOWABLE
PROTRUSION IS 0.250 PER SIDE. DIMENSIONS
A AND B DO INCLUDE MOLD MISMATCH AND
ARE DETERMINED AT DATUM PLANE AB.
DIMENSION D DOES NOT INCLUDE DAMBAR
PROTRUSION. DAMBAR PROTRUSION
SHALL NOT CAUSE THE D DIMENSION TO
EXCEED 0.350.
MINIMUM SOLDER PLATE THICKNESS
SHALL BE 0.0076.
EXACT SHAPE OF EACH CORNER IS
OPTIONAL.
R
DIM
AA
A1
B1
V1
M
S1
W
A
C
D
G
H
K
N
R
V
B
E
F
L
P
S
J
L °
MILLIMETERS
1.400
0.170
1.350
0.170
0.050
0.090
0.500
0.090
0.150
MIN
0
7.000 BSC
3.500 BSC
7.000 BSC
3.500 BSC
0.500 BSC
0.250 BSC
9.000 BSC
4.500 BSC
9.000 BSC
4.500 BSC
0.200 REF
1.000 REF
Freescale Semiconductor
12 REF
°
°
1.600
0.270
1.450
0.230
0.150
0.200
0.700
0.160
0.250
MAX
7
°