ISL6556A Intersil Corporation, ISL6556A Datasheet - Page 6

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ISL6556A

Manufacturer Part Number
ISL6556A
Description
Optimized Multi-Phase PWM Controller with 6-Bit DAC for VR10.X Application
Manufacturer
Intersil Corporation
Datasheet

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Absolute Maximum Ratings
Supply Voltage, VCC . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . +7V
Input, Output, or I/O Voltage (except OVP)GND -0.3V to V
OVP Voltage . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . +15V
ESD (Human body model . . . . . . . . . . . . . . . . . . . . . . . . . . . . . >4kV
ESD (Machine model . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . >300V
ESD (Charged device model . . . . . . . . . . . . . . . . . . . . . . . . . . >2kV
Operating Conditions
Supply Voltage, VCC (5V bias mode, Note 3) . . . . . . . . . . +5V ±5%
Junction Temperature . . . . . . . . . . . . . . . . . . . . . . . . . 0
CAUTION: Stress above those listed in “Absolute Maximum Ratings” may cause permanent damage to the device. This is a stress only rating and operation of the device
at these or any other conditions above those indicated in the operational section of this specification is not implied.
NOTES:
Electrical Specifications
VCC SUPPLY CURRENT
Nominal Supply
Shutdown Supply
SHUNT REGULATOR
VCC Voltage
VCC Sink Current
POWER-ON RESET AND ENABLE
POR Threshold
ENABLE Threshold
ENLL Input Logic Low Level
ENLL input Logic High Level
ENLL Leakage Current
REFERENCE VOLTAGE AND DAC
System Accuracy (VID=1.2V-1.6V, T
0
System Accuracy (VID=0.8375V-1.1875V
T
System Accuracy (VID=0.8375V-1.1875V,
T
VID Pull Up
VID Input Low Level
VID Input High Level
DAC Source/Sink Current
OFSOUT Source/Sink Current
REF Source/Sink Current
PIN-ADJUSTABLE OFFSET
Voltage at OFS pin
1.
2.
3. For
o
J
J
C to 85
= 25
= 0
Brief TB379.
JA
JA
o
is measured in free air with the component mounted on a high effective thermal conductivity test board with “direct attach” features. See Tech
C to 85
is measured with the component mounted on a high effective thermal conductivity test board in free air. See Tech Brief TB379 for details.
o
JC
C)
o
C)
, the “case temp” location is the center of the exposed metal pad on the package underside.
PARAMETER
o
C)
6
Operating Conditions: VCC = 5V or ICC < 25mA (Note 3), T
J
=
VCC = 5VDC; EN = 5VDC; R
ISEN1=ISEN2=ISEN3=ISEN4=-70 A
VCC = 5VDC; EN = 0VDC; R
VCC tied to 12VDC through 300 resistor, R
VCC tied to 12VDC through 300 resistor, R
VCC Rising
VCC Falling
EN Rising
Hysteresis
Fault Reset
ENLL=5V
(Note 4)
(Note 4)
(Note 4)
VID = 010100
(ISL6556ACR Only)
Offset resistor connected to ground
Voltage below VCC, offset resistor connected to VCC
o
C to 125
CC
+ 0.3V
o
ISL6556A
C
TEST CONDITIONS
T
T
= 100 k
= 100 k
Thermal Information
Thermal Resistance
Maximum Junction Temperature . . . . . . . . . . . . . . . . . . . . . . . 150
Maximum Storage Temperature Range . . . . . . . . . -65
Maximum Lead Temperature (Soldering 10s) . . . . . . . . . . . . . 300
SOIC Package (Note 1) . . . . . . . . . . . .
QFN Package (Note 2 and 3) . . . . . . .
(SOIC - Lead Tips Only)
T
T
J
= 100k
= 100k
= 0
o
C to 105
o
C. Unless Otherwise Specified .
-200
MIN
1.22
1.10
1.97
-0.5
-0.5
-0.6
485
-65
-50
-50
5.6
4.2
3.7
0.8
0.8
-
-
-
-
-
-
JA
(
o
TYP
4.31
3.82
1.24
1.14
2.03
C/W)
100
500
5.9
-50
14
10
-
-
-
-
-
-
-
-
-
-
-
-
60
33
MAX
4.50
4.00
1.26
1.18
2.09
200
515
-35
6.2
0.4
0.5
0.5
0.6
0.4
18
14
25
50
50
1
-
-
o
C to 150
JC
N/A
UNITS
3.5
(
%VID
%VID
%VID
o
mA
mA
mA
mV
mV
C/W)
V
V
V
V
V
V
V
V
V
V
A
A
A
A
A
o
o
o
C
C
C

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