KSC-1000 Kodak, KSC-1000 Datasheet - Page 13

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KSC-1000

Manufacturer Part Number
KSC-1000
Description
Timing Generator Full Program-ability Through a Simple 3-wire Serial Interface Allows Maximum Flexibility in Sensor Operation.
Manufacturer
Kodak
Datasheet
IMAGE SENSOR SOLUTIONS
13
Decoupling, Grounding and Power-Up Requirements
Each of the power supply pins (VDD_C, VDD_IO,
VDD_DLL) shall have at a minimum, local 0.1uF
ceramic de-coupling capacitors.
mended that the IO_VDD_3P3V connections also
have 10 uF de-coupling where possible to supply
current during simultaneous switching of multiple
outputs.
VDD_DLL is a 10uF tantalum, 0.1 uF ceramic,
and 100 pF ceramic connected from the pin to
ground, with a 10 ohm series resistance
connecting the pin to the 1.8 V supply.
A single, common ground plane is recommended
to reduce ground loops and local Eddy currents.
The Micro Lead Frame (MLF) package of the
KSC-1000 has a die attach ‘paddle’ on the PCB
side of the package. This paddle is connected
internally to the VSS nodes for VDD_C, VDD_IO,
and VDD_DLL. It must be externally connected to
the ground plane of the PCB during manu-
facturing.
To prevent latch-up, it is required that the higher
voltage (3.3 V) supply be powered up first. To
Electrostatic Discharge Protection
The KSC-1000TG contains protection circuitry
that is rated class B using the machine model for
Electrostatic Discharge (ESD) testing. Proper
K S C - 1 0 0 0 R e v 1 . 0
w w w . k o d a k . c o m / g o / i m a g e r s
Preferred
configuration
It is recom-
for
5 8 5 - 7 2 2 - 4 3 8 5
the
minimize the potential from power drain (crowbar
effects) during power-up, the 1.8 V supply should
follow the 3.3V supply relatively soon after. Since
a linear regulator is required for the 1.8 V supply,
it is recommended that the 1.8 V regulator be
driven off of the 3.3 V regulated supply on board.
In this manner, the above conditions should be
obtained. The DLL supply (VDD_DLL) and the
core supply (VDD_C ) should be brought up
together.
Alternately, a Schottky barrier diode can be
applied between the 3.3V and 1.8V voltage
supply pins to prevent race condition issues. In
this implementation, the anode should be
attached to the lower voltage supply (1.8 V) and
the cathode to the higher voltage supply (3.3 V).
In this case, if power is applied to the lower
voltage first, the upper supply will track the lower
less the threshold of the diode, thus preventing
latch-up.
ESD precautions are recommended to avoid
performance degradation or device failure.
E m a i l : i m a g e r s @ k o d a k . c o m

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