MPC8358E Freescale Semiconductor, MPC8358E Datasheet - Page 68

• Manufacturer Part Number: MPC8358E
• Description: (MPC8358E / MPC8360E) PowerQUICC II Pro Processor Revision 2.x TBGA Silicon Hardware Specifications
• Manufacturer: Freescale Semiconductor

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Package and Pin Listings
Figure 51
21 Package and Pin Listings
This section details package parameters, pin assignments, and dimensions. The MPC8360E/58E is
available in a tape ball grid array (TBGA), see
and
21.1
The package parameters for rev 2.0 silicon are as provided in the following list. The package type is 37.5
mm × 37.5 mm, 740 tape ball grid array (TBGA).
68
MPC8360E/MPC8358E PowerQUICC™ II Pro Processor Revision 2.x TBGA Silicon Hardware Specifications, Rev. 2
Section 21.2, “Mechanical Dimensions of the TBGA
Package outline
Interconnects
Pitch
Module height (typical)
Solder Balls
Ball diameter (typical)
Package Parameters for the TBGA Package
provide the AC test load for the USB.
Output
Figure 51. USB AC Test Load
Z
0
= 50 Ω
Section 21.1, “Package Parameters for the TBGA Package
37.5 mm × 37.5 mm
740
1.00 mm
1.46 mm
62 Sn/36 Pb/2 Ag (ZU package)
95.5 Sn/0.5 Cu/4Ag (VV package)
0.64 mm
Package,” for information on the package.
R
L
= 50 Ω
OV
DD
/2
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