NIS3001 ON Semiconductor, NIS3001 Datasheet - Page 3

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NIS3001

Manufacturer Part Number
NIS3001
Description
Integrated Driver And Mosfet Power Chip For Synchronous Buck Controllers
Manufacturer
ON Semiconductor
Datasheet
NOTE:
1. 60 seconds maximum above 183 C.
*The maximum package power dissipation must be observed.
MAXIMUM RATINGS*
Output DC Current
Pin Symbol
Operating Junction Temperature, T
Package Thermal Resistance:
Storage Temperature Range, T
ESD Susceptibility (Human Body Model)
Lead Temperature Soldering:
JEDEC Moisture Sensitivity Level
Junction to Ambient, R
Junction to Ambient, R
Junction to PCB, R
PGND
DRN
BST
VIN
TG
BG
CO
EN
VS
All voltages are with respect to PGND except where noted.
(Bootstrap Supply Return)
Bootstrap Supply Voltage
High Side Driver Output
Low Side Driver Output
TG & BG Control Input
Driver Supply Voltage
Input Supply Voltage
Switching Node
(Bottom Gate)
qJ−PCB
Enable Input
(Top Gate)
Pin Name
Ground
qJ−A
qJ−A
Input
(4 layer PCB with vias)
(4 layer PCB with vias, no air flow)
(4 layer PCB with vias, 200lfm air flow)
S
J
25 V wrt/PGND
25 V wrt/PGND
6.3 V wrt/DRN
6.3 V wrt/DRN
6.3 V
6.3 V
6.3 V
6.3 V
MAX
25 V
14 V
Rating
0 V
http://onsemi.com
NIS3001
−0.3 V wrt/DRN
−5.0 V for 20 ns
−6.0 V for 20 ns
−0.3 V wrt/DRN
3
−1.0 V DC
−0.3 V
−0.3 V
−0.3 V
−0.3 V
MIN
0 V
Reflow: (SMD styles only) (Note 1)
4.0 A Peak (< 100 ms)
4.0 A Peak (< 100 ms)
4.0 A Peak (< 100 ms)
4.0 A Peak (< 100 ms)
250 mA DC
250 mA DC
250 mA DC
250 mA DC
I
SOURCE
1.0 mA
1.0 mA
NA
NA
4.0 A Peak (< 100 ms)
4.0 A Peak (< 100 ms)
4.0 A Peak (< 100 ms)
4.0 A Peak (< 100 ms)
−65 to 150
230 peak
Value
125
500
8.0
25
26
13
250 mA DC
250 mA DC
250 mA DC
250 mA DC
3
1.0 mA
1.0 mA
I
SINK
NA
NA
Unit
MSL
C/W
A
V
C
C
C

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