NIS3001 ON Semiconductor, NIS3001 Datasheet - Page 16

• Manufacturer Part Number: NIS3001
• Description: Integrated Driver And Mosfet Power Chip For Synchronous Buck Controllers
• Manufacturer: ON Semiconductor

Rework Procedure
entire package must be removed from the PC board if there
is an issue with the solder joints. It is important to minimize
the chance of overheating neighboring devices during the
removal of the package since the devices are typically in
close proximity with each other.
procedure since the airflow and temperature gradients can
be carefully controlled. It is also recommend that the PC
board be placed in an oven at 125 C for 4 to 8 hours prior
to heating the parts to remove excess moisture from the
packages. In order to control the region, which will be
exposed to reflow temperatures, the board should be heated
to a 100 C by conduction through the backside of the board
in the location of the NIS3001 QFN Package. Typically,
heating nozzles are then used to increase the temperature
locally.
liquidus temperature, the package is quickly removed and
the pads on the PC board are cleaned. The cleaning of the
pads is typically performed with a blade−style conductive
tool with a de−soldering braid. A no clean flux is used
during this process in order to simplify the procedure.
in preparation of mounting a new device. Due to the close
Due to the fact that the NIS3001 is a leadless device, the
Standard SMT rework systems are recommended for this
Once the NIS3001’s solder joints are heated above their
Solder paste is then deposited or screened onto the site
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NIS3001
16
proximity of the neighboring packages in most PC board
configurations, a miniature stencil for the individual
component is typically required. The same stencil design
that was originally used to mount the package can be
applied to the mini−stencil for redressing the pad.
since the pads are on the underside of the package, a manual
pick and place procedure without the aid of magnification
is not recommended. A dual image optical system where
the underside of the package can be aligned to the PC board
should be used instead.
accomplished by either passing the board through the
original reflow profile, or by selectively heating the
NIS3001 Package with the same process that was used to
remove it. The benefit with subjecting the entire board to
a second reflow is that the packages will be mounted
consistently and by a profile that is already defined. The
disadvantage is that all of the other devices mounted with
the same solder type will be reflowed for a second time. If
subjecting all of the parts to a second is either a concern or
unacceptable for a specific application, than the localized
reflow option would be the recommended procedure.
Due to the small pad configurations of the NIS3001, and
Reflowing the component onto the board can be