NIS3001 ON Semiconductor, NIS3001 Datasheet - Page 2

• Manufacturer Part Number: NIS3001
• Description: Integrated Driver And Mosfet Power Chip For Synchronous Buck Controllers
• Manufacturer: ON Semiconductor

GND
PIN FUNCTION DESCRIPTIONS
CO
EN
VS
14, 18
12, 13
15, 16
20, 21
(2, 19)
Pad #
7−11,
2, 19
5, 6
17
1
3
4
(4)
(3)
(1)
+
−
Symbol
PGND
4.35 V
GND
DRN
+
−
BST
VIN
Shutdown
CO
BG
EN
VS
TG
Thermal
Logic level control input produces complementary output states.
Signal ground.
Logic level enable input forces internal driver top gate and bottom gate low, and supply current to less
than 10 mA when EN is low.
Power supplied to the internal driver. A 1.0 mF ceramic capacitor should be connected from this pin to
PGND.
Power ground. High current return path for the lower internal.
Switching Node, connected to output inductor (10).
Switching Node, connected to the boost capacitor (14).
All pins connected internally.
DC−DC converter input voltage.
High Side Driver Output (Top Gate, this pin is used to monitor the gate).
Bootstrap supply voltage input. In conjunction with a Schottky diode to Vs, a 0.1 mF to 1.0 mF ceramic
capacitor connected between BST and DRN (14).
Low Side Driver Output (Bottom Gate, this pin is used to monitor the gate).
Figure 2. Block Diagram
http://onsemi.com
Non−Overlap
Control
NIS3001
Delay
Delay
2
Shifter
Level
−
+
Description
4.0 V
BST
V
S
(17)
(20, 21)
TG
BG
(15, 16)
PGND
(5, 6)
VIN
(12, 13)
(7−11, 14, 18)
DRN