HY27LF081G2M Hynix Semiconductor, HY27LF081G2M Datasheet - Page 2

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HY27LF081G2M

Manufacturer Part Number
HY27LF081G2M
Description
1gbit 128mx8bit / 64mx16bit Nand Flash Memory
Manufacturer
Hynix Semiconductor
Datasheet
Rev 0.7 / Apr. 2005
Revision History
Revision
No.
0.5
0.6
0.7
1) Correct AC characteristics(tREH)
2) Add Errata
1) Change AC characteristics
2) Add tADL parameter
- tADL=100ns
3) Correct table.9
1) Correct AC Timing Characteristics Table
- Errata value is eddited.
- tADL(max) is changed to tADL(min).
2) Change Errata
- tREA is deleted from the errata
3) Edit pin Description table
4) Delete Multiple Die & Stacked Devices Access
- Texts & tables are deleted.
5) Edit Data Protection texts
6) Add Read ID table
7) Add tOH parameter
- tOH= 15ns(min.)
8) Add Marking Information
9) Correct application note.2
- tCS(2us) is changed to 100ns.
Specification Read(all)
before: 30ns-> after: 20ns
Relaxed
Before
Before
After
value
After
Except for
Read (all)
Except for
ID Read
ID Read
ID Read
ID Read
Case
Case
tDH
10
15
History
tRC
tRC
50
60
60
50
50
60
1Gbit (128Mx8bit / 64Mx16bit) NAND Flash
tRP
tRP
20
25
25
20
20
25
tREH
tREH
20
30
30
20
20
30
HY27UF(08/16)1G2M Series
HY27SF(08/16)1G2M Series
tREA
30
30
30
Jan. 25. 2005
Mar. 09. 2005
Apr. 06. 2005
Draft Date
- Continued -
Preliminary
Preliminary
Preliminary
Preliminary
Remark
2

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