NC7SV126P5X Fairchild Semiconductor, NC7SV126P5X Datasheet - Page 10

IC BUFF TRI-ST ULP-A SC705

NC7SV126P5X

Manufacturer Part Number
NC7SV126P5X
Description
IC BUFF TRI-ST ULP-A SC705
Manufacturer
Fairchild Semiconductor
Series
7SVr
Datasheet

Specifications of NC7SV126P5X

Logic Type
Buffer/Line Driver, Non-Inverting
Number Of Elements
1
Number Of Bits Per Element
1
Current - Output High, Low
24mA, 24mA
Voltage - Supply
0.9 V ~ 3.6 V
Operating Temperature
-40°C ~ 85°C
Mounting Type
Surface Mount
Package / Case
SC-70-5, SC-88A, SOT-323-5, SOT-353, 5-TSSOP
Logic Family
NC7SV
Number Of Channels Per Chip
Single
Polarity
Non-Inverting
Supply Voltage (max)
3.6 V
Supply Voltage (min)
0.9 V
Maximum Operating Temperature
85 C
Mounting Style
SMD/SMT
High Level Output Current
- 24 mA
Input Bias Current (max)
0.9 uA
Low Level Output Current
24 mA
Minimum Operating Temperature
- 40 C
Number Of Lines (input / Output)
1
Output Type
3-State
Propagation Delay Time
4.3 ns @ 1.8 V or 2.8 ns @ 2.5 V or 2.6 ns @ 3.15 V
Logic Device Type
Buffer, Non Inverting
Supply Voltage Range
0.9V To 3.6V
Logic Case Style
SC-70
No. Of Pins
5
Operating Temperature Range
-40°C To +85°C
Supply Voltage Min
0.9V
Rohs Compliant
Yes
Leaded Process Compatible
Yes
Lead Free Status / RoHS Status
Lead free / RoHS Compliant

Available stocks

Company
Part Number
Manufacturer
Quantity
Price
Part Number:
NC7SV126P5X
Manufacturer:
FAIRCHILD/仙童
Quantity:
20 000
Company:
Part Number:
NC7SV126P5X
Quantity:
6 000
© 1996 Fairchild Semiconductor Corporation
NC7SV126 • Rev. 1.0.2
Physical Dimensions
Package drawings are provided as a service to customers considering Fairchild components. Drawings may change in any manner
without notice. Please note the revision and/or date on the drawing and contact a Fairchild Semiconductor representative to verify
or obtain the most recent revision. Package specifications do not expand the terms of Fairchild’s worldwide terms and conditions, specifically
the warranty therein, which covers Fairchild products.
Always visit Fairchild Semiconductor’s online packaging area for the most recent package drawings:
http://www.fairchildsemi.com/packaging/.
Tape and Reel Specification
Please visit Fairchild Semiconductor’s online packaging area for the most recent tape and reel specifications:
http://www.fairchildsemi.com/products/logic/pdf/micropak_tr.pdf.
Package Designator
L6X
DETAIL A
Notes:
1. CONFORMS TO JEDEC STANDARD M0-252 VARIATION UAAD
2. DIMENSIONS ARE IN MILLIMETERS
3. DRAWING CONFORMS TO ASME Y14.5M-1994
MAC06AREVC
0.05 C
2X
(0.05)
6X
0.05 C
Leader (Start End)
0.55MAX
Trailer (Hub End)
Tape Section
C
Figure 8. 6-Lead, MicroPak™, 1.0mm Wide
BOTTOM VIEW
Carrier
TOP VIEW
1.45
1.0
0.5
Cavity Number
0.25
0.15
1.00
2X
0.40
0.30
0.35
0.25
0.05
0.00
125 (Typical)
0.10
0.05
10
75 (Typical)
B
(0.13)
4X
6X
0.05 C
5X
5X
5000
A
0.05 C
C B A
C
PIN 1
1X
CHAMFER
0.075 X 45
(0.52)
5X
(0.49)
Cavity Status Cover Type Status
RECOMMENED
LAND PATTERN
Empty
Empty
Filled
(0.30)
0.10
0.00
6X
(1)
DETAIL A
PIN 1 TERMINAL
6X
0.40
0.30
(0.75)
0.45
0.35
Sealed
Sealed
Sealed
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