ST72262G1 STMicroelectronics, ST72262G1 Datasheet - Page 160

• Manufacturer Part Number: ST72262G1
• Description: 8-BIT MCU WITH FLASH OR ROM MEMORY, ADC, TWO 16-BIT TIMERS, I2C, SPI, SCI INTERFACES
• Manufacturer: STMicroelectronics

Specifications of ST72262G1

• 4 K Or 8 Kbytes Program Memory: ROM or single voltage extended Flash (XFlash) with read-out protection, write protection, In-Circuit Programming and In-Application Programming (ICP and IAP). 10K write/erase cycles guaranteed, data retention
• Clock Sources: crystal/ceramic resonator oscillators, internal RC oscillator and bypass for external clock
• 4 Power Saving Modes: Halt, Active Halt,Wait and Slow
• Two 16-bit Timers With: 2 input captures, 2 output compares, external clock input on one timer, PWM and Pulse generator modes

ST72260Gx, ST72262Gx, ST72264Gx
Figure 104. Low Profile Fine Pitch Ball Grid Array Package
14.2 THERMAL CHARACTERISTICS
Notes:
1. The power dissipation is obtained from the formula P
and P
2. The average chip-junction temperature can be obtained from the formula T
160/172
PORT
Symbol
T
R
Jmax
P
is the port power dissipation determined by the user.
thJA
D
SEATING
PLANE
C
Package thermal resistance (junction to ambient)
Power dissipation
Maximum junction temperature
A1 CORNER INDEX AREA
(SEE NOTE 3)
e
BOTTOM VIEW
D1
D
1)
LFBGA 6x6 (on single-layer PCB)
LFBGA 6x6 (on multilayer PCB)
Ratings
f
∅b (36 BALLS)
D
=P
2)
INT
+P
PORT
where P
SDIP32
SO28
J
= T
INT
Dim
ddd
A1 0.270
A2
D1
E1
A
D
b
E
e
f
A
is the chip internal power (I
+ P
1.210
0.450 0.500 0.550 0.018 0.020 0.022
5.750 6.000 6.150 0.226 0.236 0.242
5.750 6.000 6.150 0.226 0.236 0.242
0.720 0.800 0.880 0.028 0.031 0.035
0.850 1.000 1.150 0.033 0.039 0.045
Min
D
x RthJA.
1.120
4.000
4.000
mm
Typ Max Min
Value
150
500
60
75
56
72
1.700 0.048
0.120
0.011
inches
0.044
0.157
0.157
Typ Max
°C/W
DD
Unit
mW
°C
0.067
0.005
xV
DD
)