LPC1857_53 NXP Semiconductors, LPC1857_53 Datasheet - Page 84

• Manufacturer Part Number: LPC1857_53
• Description: The LPC1857/53 are ARM Cortex-M3 based microcontrollers for embedded applications
• Manufacturer: NXP Semiconductors

NXP Semiconductors
9. Thermal characteristics
Table 7.
V
LPC1857_53
Objective data sheet
Symbol
T
DD
j(max)
= 2.2 V to 3.6 V; T
Thermal characteristics
Parameter
maximum junction
temperature
amb
The average chip junction temperature, T
equation:
The internal power dissipation is the product of I
the I/O pins is often small and many times can be negligible. However it can be significant
in some applications.
T
=
•
•
•
j
=

T
R
P
40
amb
D
T
th(j-a)
amb

= sum of internal and I/O power dissipation
C to +85
= ambient temperature (C),
+
= the package junction-to-ambient thermal resistance (C/W)

P
D
All information provided in this document is subject to legal disclaimers.

Conditions

C unless otherwise specified;
R
th j a
Rev. 1 — 14 December 2011

–


j
(C), can be calculated using the following
Min
-
DD
32-bit ARM Cortex-M3 microcontroller
and V
DD
Typ
-
. The I/O power dissipation of
LPC1857/53
Max
<tbd>
© NXP B.V. 2011. All rights reserved.
Unit
84 of 131
C
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