LPC1857_53 NXP Semiconductors, LPC1857_53 Datasheet - Page 119

• Manufacturer Part Number: LPC1857_53
• Description: The LPC1857/53 are ARM Cortex-M3 based microcontrollers for embedded applications
• Manufacturer: NXP Semiconductors

NXP Semiconductors
14. Package outline
Fig 35. Package outline of the LBGA256 package
LPC1857_53
Objective data sheet
LBGA256: plastic low profile ball grid array package; 256 balls; body 17 x 17 x 1 mm
DIMENSIONS (mm are the original dimensions)
UNIT
mm
SOT740-2
VERSION
OUTLINE
max
1.55
A
ball A1
index area
ball A1
index area
0.45
0.35
A
1
M
K
H
D
B
T
P
F
G
R
N
C
A
L
E
J
1.1
0.9
A
2
1
IEC
- - -
2
0.55
0.45
b
3
e
4
17.2
16.8
5
D
6
7
17.2
16.8
8
MO-192
JEDEC
E
e
D
All information provided in this document is subject to legal disclaimers.
1
9
10
1/2 e
REFERENCES
11
e
1
Rev. 1 — 14 December 2011
12
13
0
15
e
14
1
b
15
JEITA
16
15
e
- - -
2
scale
5
1/2 e
0.25
B
v
∅
∅
e
w
v
A
E
e
M
M
2
0.1
w
C
C
10 mm
A B
0.12
y
32-bit ARM Cortex-M3 microcontroller
A
0.35
y
A
1
y
2
1
C
A
1
PROJECTION
EUROPEAN
detail X
LPC1857/53
X
C
y
© NXP B.V. 2011. All rights reserved.
ISSUE DATE
05-06-16
05-08-04
SOT740-2
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