AT89C51AC3 Atmel Corporation, AT89C51AC3 Datasheet - Page 121

• Manufacturer Part Number: AT89C51AC3
• Manufacturer: Atmel Corporation

Specifications of AT89C51AC3

• Flash (kbytes): 64 Kbytes
• Max. Operating Frequency: 60 MHz
• Cpu: 8051-12C
• Max I/o Pins: 32
• Spi: 1
• Uart: 1
• Adc Channels: 8
• Adc Resolution (bits): 10
• Adc Speed (ksps): 62.5
• Sram (kbytes): 2.25
• Eeprom (bytes): 2048
• Self Program Memory: API
• Operating Voltage (vcc): 3.0 to 5.5
• Timers: 4
• Isp: UART
• Watchdog: Yes

Electrical Characteristics
Absolute Maximum Ratings
DC Parameters for Standard Voltage
T
V
V
Table 71. DC Parameters in Standard Voltage
4383D–8051–02/08
Ambiant Temperature Under Bias:
I = industrial ....................................................... -40°C to 85°C
Storage Temperature .................................... -65°C to + 150°C
Voltage on V
Voltage on Any Pin from V
Power Dissipation .............................................................. 1 W
A
CC
CC
Symbol
= -40°C to +85°C; V
V
R
V
V
=2.7V to 5.5V and F = 0 to 40 MHz (both internal and external code execution)
=4.5V to 5.5V and F = 0 to 60 MHz (internal code execution only)
V
V
C
V
V
I
I
OH1
I
I
OL1
RST
PD
TL
IH1
OH
IL
LI
OL
IH
IO
IL
Parameter
Input Low Voltage
Input High Voltage except XTAL1, RST
Input High Voltage, XTAL1, RST
Output Low Voltage, ports 1, 2, 3 and 4
Output Low Voltage, port 0, ALE, PSEN
Output High Voltage, ports 1, 2, 3, and 4
Output High Voltage, port 0, ALE, PSEN
RST Pulldown Resistor
Logical 0 Input Current ports 1, 2, 3 and 4
Input Leakage Current
Logical 1 to 0 Transition Current, ports 1, 2, 3
and 4
Capacitance of I/O Buffer
Power-down Current
CC
from V
SS
SS
......................................-0.5V to + 6V
SS
= 0V;
..................... -0.5V to V
(6)
(6)
CC
+ 0.2V
0.2 V
V
V
V
V
V
V
0.7 V
CC
CC
CC
CC
CC
CC
Min
-0.5
CC
50
Note:
- 0.3
- 0.7
- 1.5
- 0.3
- 0.7
- 1.5
CC
+ 0.9
Stresses at or above those listed under “Absolute Maximum
Ratings” may cause permanent damage to the device. This
is a stress rating only and functional operation of the device
at these or any other conditions above those indicated in
the operational sections of this specification is not implied.
Exposure to absolute maximum rating conditions may affect
device reliability.
The power dissipation is based on the maximum allowable
die temperature and the thermal resistance of the package.
Typ
100
75
(5)
0.2Vcc - 0.1
V
V
CC
CC
Max
-650
0.45
0.45
200
150
±10
0.3
1.0
0.3
1.0
-50
10
+ 0.5
+ 0.5
Unit
kΩ
µA
µA
µA
pF
µA
V
V
V
V
V
V
V
V
V
V
V
V
V
V
V
I
I
I
I
I
I
I
I
I
V
I
I
I
V
Vin = 0.45V
0.45V < Vin < V
Vin = 2.0V
Fc = 1 MHz
T
3V < V
OL
OL
OL
OL
OL
OL
OH
OH
OH
OH
OH
OH
A
CC
CC
= 25°C
= 100 µA
= 1.6 mA
= 3.5 mA
= 200 µA
= 3.2 mA
= 7.0 mA
= -10 µA
= -30 µA
= -60 µA
= -200 µA
= -3.2 mA
= -7.0 mA
= 3V to 5.5V
= 5V ± 10%
Test Conditions
CC
< 5.5V
(4)
(4)
(4)
(4)
(4)
(4)
CC
(3)
121