SC16C752IB48,157 NXP Semiconductors, SC16C752IB48,157 Datasheet - Page 45

• Manufacturer Part Number: SC16C752IB48,157
• Description: IC DUAL UART 64BYTE 48LQFP
• Manufacturer: NXP Semiconductors

Specifications of SC16C752IB48,157

• Number Of Channels: 2, DUART
• Fifo's: 64 Byte
• Voltage - Supply: 2.5V, 3.3V, 5V
• With Auto Flow Control: Yes
• With False Start Bit Detection: Yes
• With Modem Control: Yes
• Mounting Type: Surface Mount
• Package / Case: 48-LQFP
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• Other names: 935270055157; SC16C752IB48; SC16C752IB48

Philips Semiconductors
14. Revision history
Table 28:
9397 750 11635
Product data
Rev Date
04
03
02
01
20030620
20030313
20021216
20020910
Revision history
CPCN
-
-
-
-
Description
Product data (9397 750 11635); ECN 853-2379 30031 of 16 June 2003.
Modifications:
Product data (9397 750 11196); ECN 853-2379 29623 of 10 March 2003.
Product data (9397 750 10811); ECN 853-2379 29261 of 06 December 2002.
Product data (9397 750 09575); ECN 853-2379 28891 of 10 September 2002.
[3]
[4]
[5]
[6]
[7]
•
Figure 12 “Crystal oscillator connections.” on page
added connection with resistor.
These transparent plastic packages are extremely sensitive to reflow soldering conditions and must
on no account be processed through more than one soldering cycle or subjected to infrared reflow
soldering with peak temperature exceeding 217 C
oven. The package body peak temperature must be kept as low as possible.
These packages are not suitable for wave soldering. On versions with the heatsink on the bottom
side, the solder cannot penetrate between the printed-circuit board and the heatsink. On versions with
the heatsink on the top side, the solder might be deposited on the heatsink surface.
If wave soldering is considered, then the package must be placed at a 45 angle to the solder wave
direction. The package footprint must incorporate solder thieves downstream and at the side corners.
Wave soldering is suitable for LQFP, QFP and TQFP packages with a pitch (e) larger than 0.8 mm; it
is definitely not suitable for packages with a pitch (e) equal to or smaller than 0.65 mm.
Wave soldering is suitable for SSOP and TSSOP packages with a pitch (e) equal to or larger than
0.65 mm; it is definitely not suitable for packages with a pitch (e) equal to or smaller than 0.5 mm.
Rev. 04 — 20 June 2003
10 C measured in the atmosphere of the reflow
18: capacitors’ values changed and
© Koninklijke Philips Electronics N.V. 2003. All rights reserved.
Dual UART with 64-byte FIFO
SC16C752
45 of 47