SC16C2550BIBS,157 NXP Semiconductors, SC16C2550BIBS,157 Datasheet - Page 40
![IC DUART SOT617-1](/photos/6/51/65170/568-32-hvqfn_sml.jpg)
SC16C2550BIBS,157
Manufacturer Part Number
SC16C2550BIBS,157
Description
IC DUART SOT617-1
Manufacturer
NXP Semiconductors
Datasheet
1.SC16C2550BIA44518.pdf
(43 pages)
Specifications of SC16C2550BIBS,157
Features
False-start Bit Detection
Number Of Channels
2, DUART
Fifo's
16 Byte
Voltage - Supply
3.5 V ~ 4.5 V
With Auto Flow Control
Yes
With False Start Bit Detection
Yes
With Modem Control
Yes
With Cmos
Yes
Mounting Type
Surface Mount
Package / Case
32-VFQFN Exposed Pad
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Other names
935280309157
SC16C2550BIBS
SC16C2550BIBS
SC16C2550BIBS
SC16C2550BIBS
NXP Semiconductors
14. Abbreviations
SC16C2550B_5
Product data sheet
13.4 Package related soldering information
Table 28.
[1]
[2]
Table 29.
Package
CPGA, HCPGA
DBS, DIP, HDIP, RDBS, SDIP, SIL
PMFP
Acronym
CPU
DLL
DLM
DMA
FIFO
ISDN
LSB
MSB
RHR
THR
TTL
UART
For SDIP packages, the longitudinal axis must be parallel to the transport direction of the printed-circuit
board.
For PMFP packages hot bar soldering or manual soldering is suitable.
[2]
Suitability of through-hole mount IC packages for dipping and wave soldering
Abbreviations
Description
Central Processing Unit
Divisor Latch LSB
Divisor Latch MSB
Direct Memory Access
First In/First Out
Integrated Service Digital Network
Least Significant Bit
Most Significant Bit
Receive Holding Register
Transmit Holding Register
Transistor-Transistor Logic
Universal Asynchronous Receiver/Transmitter
5 V, 3.3 V and 2.5 V dual UART, 5 Mbit/s (max.), with 16-byte FIFOs
Rev. 05 — 12 January 2009
Soldering method
Dipping
-
suitable
-
SC16C2550B
Wave
suitable
suitable
not suitable
© NXP B.V. 2009. All rights reserved.
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