SC16IS741IPW,128 NXP Semiconductors, SC16IS741IPW,128 Datasheet - Page 28

• Manufacturer Part Number: SC16IS741IPW,128
• Description: IC UART 16TSSOP
• Manufacturer: NXP Semiconductors
• Type: IrDA or RS-232 or RS-485r

Specifications of SC16IS741IPW,128

• Number Of Channels: 1, UART
• Package / Case: 16-TSSOP (0.173", 4.40mm Width)
• Features: RS-485
• Fifo's: 64 Byte
• Protocol: RS232, RS485
• Voltage - Supply: 2.5V, 3.3V
• With Auto Flow Control: Yes
• With Irda Encoder/decoder: Yes
• With False Start Bit Detection: Yes
• With Modem Control: Yes
• Mounting Type: Surface Mount
• Data Rate: 5 Mbps
• Supply Voltage (max): 3.6 V
• Supply Voltage (min): 2.3 V
• Supply Current: 6 mA
• Maximum Operating Temperature: + 85 C
• Minimum Operating Temperature: - 40 C
• Mounting Style: SMD/SMT
• Operating Supply Voltage: 2.5 V, 3.3 V
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant, Lead free / RoHS Compliant
• Other names: 935290736128

NXP Semiconductors
UJA1076_2
Product data sheet
Table 9.
[1]
[2]
Symbol
R
Fig 14. HTSSOP32 thermal resistance junction to ambient as a function of PCB copper
th(j-a)
According to JEDEC JESD51-2 and JESD51-3 at natural convection on 1s board.
According to JEDEC JESD51-2, JESD51-5 and JESD51-7 at natural convection on 2s2p board. Board with
two inner copper layers (thickness: 35 μm) and thermal via array under the exposed pad connected to the
first inner copper layer.
R
(K/W)
th(j-a)
90
70
50
30
area
Parameter
thermal resistance from junction to
ambient
Thermal characteristics
0
with heatsink top layer
All information provided in this document is subject to legal disclaimers.
Rev. 02 — 27 May 2010
2
without heatsink top layer
4
High-speed CAN core system basis chip
Conditions
single-layer board
four-layer board
6
PCB Cu heatsink area (cm
8
UJA1076
015aaa138
© NXP B.V. 2010. All rights reserved.
2
[1]
[2]
)
Typ
78
39
10
Unit
K/W
K/W
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