SI3200-FS Silicon Laboratories Inc, SI3200-FS Datasheet - Page 101

• Manufacturer Part Number: SI3200-FS
• Description: IC LINEFEED INTRFC 100V 16SOIC
• Manufacturer: Silicon Laboratories Inc
• Series: ProSLIC®r

Specifications of SI3200-FS

• Package / Case: 16-SOIC (3.9mm Width)
• Function: Subscriber Line Interface Concept (SLIC), CODEC
• Interface: GCI, PCM, SPI
• Number Of Circuits: 2
• Voltage - Supply: 3.3V, 5V
• Current - Supply: 110µA
• Power (watts): 941mW
• Operating Temperature: -40°C ~ 85°C
• Mounting Type: Surface Mount
• Includes: Battery Switching, BORSCHT Functions, DTMF Generation and Decoding, FSK Tone Generation, Modem and Fax Tone Detection
• Product: SLIC
• Supply Voltage (min): 3.13 V
• Supply Current: 0.11 mA, 8.8 mA
• Maximum Operating Temperature: + 70 C
• Minimum Operating Temperature: 0 C
• Mounting Style: SMD/SMT
• Number Of Channels: 2
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant

Pin #(s)
epad
12
13
14
15
16
Symbol
IRINGN
IRINGP
THERM
ITIPN
ITIPP
GND
Output
Input/
O
I
I
I
I
Description
Negative RING Current Control.
Connect to the IRINGN lead of the Si3220 or Si3225.
Positive RING Current Drive.
Connect to the IRINGP lead of the Si3220 or Si3225.
Thermal Sensor.
Connect to THERM pin of Si3220 or Si3225.
Negative TIP Current Control.
Connect to the ITIPN lead of the Si3220 or Si3225.
Positive TIP Current Control.
Connect to the ITIPP lead of the Si3220 or Si3225.
Exposed Die Paddle Ground.
For adequate thermal management, the exposed die paddle should be sol-
dered to a PCB pad that is connected to low-impedance inner and/or back-
side ground planes using multiple vias. See “Package Outline: 16-Pin
ESOIC” for PCB pad dimensions.
Rev. 1.0
Si3220/Si3225
101