PIC18F1320-H/ML Microchip Technology, PIC18F1320-H/ML Datasheet - Page 290
![no-image](/images/manufacturer_photos/0/4/439/microchip_technology_sml.jpg)
PIC18F1320-H/ML
Manufacturer Part Number
PIC18F1320-H/ML
Description
IC MCU 8BIT 8KB FLASH 28QFN
Manufacturer
Microchip Technology
Series
PIC® 18Fr
Datasheet
1.PIC18F1220-ISO.pdf
(308 pages)
Specifications of PIC18F1320-H/ML
Core Processor
PIC
Core Size
8-Bit
Speed
25MHz
Connectivity
UART/USART
Peripherals
Brown-out Detect/Reset, LVD, POR, PWM, WDT
Number Of I /o
16
Program Memory Size
8KB (4K x 16)
Program Memory Type
FLASH
Eeprom Size
256 x 8
Ram Size
256 x 8
Voltage - Supply (vcc/vdd)
4.2 V ~ 5.5 V
Data Converters
A/D 7x10b
Oscillator Type
Internal
Operating Temperature
-40°C ~ 150°C
Package / Case
28-VQFN Exposed Pad
Lead Free Status / Rohs Status
Lead free / RoHS Compliant
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PIC18F1220/1320
DS39605F-page 288
20-Lead Plastic Shrink Small Outline (SS) – 5.30 mm Body [SSOP]
Notes:
1. Pin 1 visual index feature may vary, but must be located within the hatched area.
2. Dimensions D and E1 do not include mold flash or protrusions. Mold flash or protrusions shall not exceed 0.20 mm per side.
3. Dimensioning and tolerancing per ASME Y14.5M.
Note:
BSC: Basic Dimension. Theoretically exact value shown without tolerances.
REF: Reference Dimension, usually without tolerance, for information purposes only.
NOTE 1
For the most current package drawings, please see the Microchip Packaging Specification located at
http://www.microchip.com/packaging
A
A1
Number of Pins
Pitch
Overall Height
Molded Package Thickness
Standoff
Overall Width
Molded Package Width
Overall Length
Foot Length
Footprint
Lead Thickness
Foot Angle
Lead Width
N
1 2
b
D
Dimension Limits
e
E1
A2
Units
A2
A1
E1
L1
N
D
e
A
E
L
b
c
φ
E
c
1.65
0.05
7.40
5.00
6.90
0.55
0.09
0.22
MIN
0°
–
L1
MILLIMETERS
0.65 BSC
1.25 REF
NOM
1.75
7.80
5.30
7.20
0.75
20
4°
–
–
–
–
Microchip Technology Drawing C04-072B
© 2007 Microchip Technology Inc.
MAX
2.00
1.85
8.20
5.60
7.50
0.95
0.25
0.38
8°
–
φ
L
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