LH28F160BVHE-BTL90 Sharp Electronics, LH28F160BVHE-BTL90 Datasheet - Page 42

• Manufacturer Part Number: LH28F160BVHE-BTL90
• Manufacturer: Sharp Electronics

Specifications of LH28F160BVHE-BTL90

• Cell Type: NOR
• Density: 16Mb
• Access Time (max): 90ns
• Interface Type: Parallel
• Boot Type: Bottom
• Address Bus: 21/20Bit
• Operating Supply Voltage (typ): 3.3V
• Operating Temp Range: -40C to 85C
• Package Type: TSOP
• Sync/async: Asynchronous
• Operating Temperature Classification: Industrial
• Operating Supply Voltage (min): 2.7V
• Operating Supply Voltage (max): 3.6V
• Word Size: 8/16Bit
• Number Of Words: 2M/1M
• Supply Current: 30mA
• Mounting: Surface Mount
• Pin Count: 48
• Lead Free Status / Rohs Status: Not Compliant

((Supplementary
SHARP
Product
Packing
Mounting method
Reflow soldering
Measurement point
Note
Storage conditions
data)
name(Package)
spec if icat ion
Recommended Reflow
Recommended mounting conditions
conditions
Soldering(Air)
rate
Tray (Dry packing)
After
LHFlGVll
LH28F160BVHE-BTL90 (TSOP48-P-1220)
Reflow soldering
Peak temperature
200°C or over,
Preheat
than 180 seconds.
an environment
dry packing
within
applicable,
The recommended conditions
l--4”C/s
IC package surface
a relative
If doing reflow
reflow
If the above
at 120°C.
(Heat resistance
Time
LHFlGVll
I-4C/secand
opening the dry packing,
_
soldering
72 hours after
temperature
econd.
humidity
for two time reflow
and do the second reflow
bake it before
Temperature
storage
duration
with
soldering
of 230°C or less.
within
(Air)
tray
Temperature
Peak
of 125-15O”C,
a temperature
of 60% or less.
the first
conditions
is used for shipping
temperature
of less than 40 seconds.
72 hours after
Profile
twice,do
reflow
are 16-24 hours
increase
soldering
store
reflow
are not
duration
of 5%25°C and
soldering.
the first
the ICs in
soldering
(NO. 981110-X13)
rate of
opening
soldering.
.
of less
tray.)