LFE2-20E-5FN256I Lattice, LFE2-20E-5FN256I Datasheet - Page 386
![no-image](/images/manufacturer_photos/0/3/380/lattice_sml.jpg)
LFE2-20E-5FN256I
Manufacturer Part Number
LFE2-20E-5FN256I
Description
IC FPGA 21KLUTS 193I/O 256FPBGA
Manufacturer
Lattice
Series
ECP2r
Datasheets
1.LFE2-12SE-6FN256C.pdf
(389 pages)
2.LFE3-35EA-8FN672I.pdf
(21 pages)
3.LFE2-20E-5FN256I.pdf
(4 pages)
4.LFE2-20E-5FN256I.pdf
(769 pages)
Specifications of LFE2-20E-5FN256I
Number Of Logic Elements/cells
21000
Number Of Labs/clbs
2625
Total Ram Bits
282624
Number Of I /o
193
Number Of Gates
-
Voltage - Supply
1.14 V ~ 1.26 V
Mounting Type
Surface Mount
Operating Temperature
-40°C ~ 100°C
Package / Case
256-BGA
Lead Free Status / Rohs Status
Lead free / RoHS Compliant
Other names
220-1170
LFE2-20E-5FN256I
Q6411457
LFE2-20E-5FN256I
Q6411457
Available stocks
Company
Part Number
Manufacturer
Quantity
Price
Company:
Part Number:
LFE2-20E-5FN256I
Manufacturer:
Lattice Semiconductor Corporation
Quantity:
10 000
- LFE2-12SE-6FN256C PDF datasheet
- LFE3-35EA-8FN672I PDF datasheet #2
- LFE2-20E-5FN256I PDF datasheet #3
- LFE2-20E-5FN256I PDF datasheet #4
- Current page: 386 of 389
- Download datasheet (5Mb)
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© 2011 Lattice Semiconductor Corp. All Lattice trademarks, registered trademarks, patents, and disclaimers are as listed at www.latticesemi.com/legal. All other brand
or product names are trademarks or registered trademarks of their respective holders. The specifications and information herein are subject to change without notice.
April 2011
February 2006
August 2006
Date
Version
01.0
01.1
Pinout Information
DC and Switching
Characteristics
Introduction
Architecture
Section
—
LatticeECP2/M Family Data Sheet
Initial release.
Updated Table 1-1 “LatticeECP2 Family Selection Guide”.
Updated Figure 2-2 “PFU Diagram”.
Updated Figure 2-13 “Secondary Clock Regions ECP2-50”.
Updated Figure 2-25 “PIC Diagram”.
Updated Figure 2-26 “Input Register Block for Left, Right and Bottom
Edges”.
Updated Figure 2-28 “Output Register Block for Left, Right and Bottom
Edges”.
Updated Figure 2-30 “DQS Input Routing for Left and Right Edges”.
Updated Figure 2-32 “Edge Clock, DLL Calibration and DQS Local Bus
Distribution”.
Table 2-15 Selectable Master Clock (CCLK) Frequencies - Removed
frequencies 15, 20, 21, 22, 23, 30, 34, 41, 45, 51, 55, 60.
Replaced “CLKINDEL” with “CLKO”.
Updated SED section.
Qualified device migration capability when using DQS banks for DDR
interfaces.
Added VCCPLL to the Recommended Operating Conditions table.
Removed note 5 from “Hot Specifications” section.
Added notes 7 and 8 to “Initialization Supply” Current table.
Change note 6 - “...down to 95MHz” to “...down to 95MHz for DDR and
133MHz for DDR2” .
New “Typical Building Block Function Performance” numbers.
New External Switching Characteristics numbers.
New Internal Switching Characteristics numbers.
New Family Timing Adders numbers.
Updated Timings for GPLLs, SPLLs and DLLs.
Added sysCONFIG waveforms.
Remove HSTL15D_II from sysIO Recommended Operating Conditions
table.
Updated Supply and Initialization Currents for ECP2-50.
Added VCCPLL to the Signal Descriptions table.
Updated Logic Signal Connections tables to include 484-fpBGA for the
ECP2-50.
Added Logic Signal Connections tables for ECP2-12 devices.
Updated Pin Information Summary table to include ECP2-12.
Updated Power Supply and NC Connections table to include ECP2-12.
Added note 2 to DDR Strobe (DQS) Pin table.
Added Information on: PCI, DDR & SPI4.2 Capabilities of the device-
Package combination.
7-1
Change Summary
Revision History
DS1006 Revision History
Data Sheet DS1006
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