S29GL256S10TFI010 Spansion Inc., S29GL256S10TFI010 Datasheet - Page 65

• Manufacturer Part Number: S29GL256S10TFI010
• Description: Flash 256 MBIT 3V 100NS PAGE MODE FLASH
• Manufacturer: Spansion Inc.

Specifications of S29GL256S10TFI010

• Data Bus Width: 16 bit
• Memory Type: Flash
• Memory Size: 256 Mbit
• Architecture: Uniform
• Timing Type: Asynchronous
• Interface Type: CFI
• Access Time: 100 ns
• Supply Voltage (max): 3.6 V
• Supply Voltage (min): 2.7 V
• Maximum Operating Current: 100 mA
• Operating Temperature: - 40 C to + 85 C
• Mounting Style: SMD/SMT
• Package / Case: TSOP-56
• Lead Free Status / Rohs Status: Compliant

Hardware Interface
7. Signal Descriptions
7.1
7.2
7.3
7.4
February 11, 2011 S29GL_128S_01GS_00_01
Address and Data Configuration
Input/Output Summary
Versatile I/O Feature
Ready/Busy# (RY/BY#)
Address and data are connected in parallel (ADP) via separate signal inputs and I/Os.
The maximum output voltage level driven by, and input levels acceptable to, the device are determined by the
V
same bus having interface signal levels different from the device core voltage.
RY/BY# is a dedicated, open drain output pin that indicates whether an Embedded Algorithm, Power-On
Reset (POR), or Hardware Reset is in progress or complete. The RY/BY# status is valid after the rising edge
of the final WE# pulse in a command sequence, when V
RESET#
CE#
OE#
WE#
A
DQ15-DQ0
WP#
RY/BY#
V
V
V
NC
RFU
DNU
IO
MAX
CC
IO
SS
D a t a
power supply. This supply allows the device to drive and receive signals to and from other devices on the
-A0
Symbol
S h e e t
Output - open drain
Input
Input
Input
Input
Input
Input/Output
Input
Power Supply
Power Supply
Power Supply
No Connect
No Connect
Reserved
Type
( A d v a n c e
GL-S MirrorBit
Hardware Reset. At V
for reading array data.
Chip Enable. At V
Output Enable. At V
high impedance (High-Z).
Write Enable. At V
transfer is from device to host.
Address inputs.
A25-A0 for S29GL01GS
A24-A0 for S29GL512S
A23-A0 for S29GL256S
A22-A0 for S29GL128S
Data inputs and outputs
Write Protect. At V
64 kword (128 kB) sector of the device. At V
internal pull up; When unconnected WP# is at V
Ready/Busy. Indicates whether an Embedded Algorithm is in progress or complete. At V
the device is actively engaged in an Embedded Algorithm such as erasing or programming.
At High-Z, the device is ready for read or a new command write - requires external pull-up
resistor to detect the High-Z state. Multiple devices may have their RY/BY# outputs tied
together to detect when all devices are ready.
Core power supply
Versatile IO power supply.
Power supplies ground
Not Connected internally. The pin/ball location may be used in Printed Circuit Board (PCB)
as part of a routing channel.
Reserved for Future Use. Not currently connected internally but the pin/ball location should
be left unconnected and unused by PCB routing channel for future compatibility. The pin/ball
may be used by a signal in the future.
Do Not Use. Reserved for use by Spansion. The pin/ball is connected internally. The input
has an internal pull down resistance to V
the PCB.
Table 7.1 I/O Summary
I n f o r m a t i o n )
®
Family
IL
IL
IL
, selects the device for data transfer with the host memory controller.
IL
, indicates data transfer from host to device. At V
, disables program and erase functions in the lowest or highest address
, causes outputs to be actively driven. At V
IL
, causes the device to reset control logic to its standby state, ready
CC
is above V
Description
SS
CC
. The pin/ball can be left open or tied to V
IH
, the sector is not protected. WP# has an
minimum during POR, or after the
IH
.
IH
, causes outputs to be
IH
, indicates data
SS
on
IL
65
,