MT46V16M16P-5B:M Micron Technology Inc, MT46V16M16P-5B:M Datasheet - Page 75

• Manufacturer Part Number: MT46V16M16P-5B:M
• Description: IC SDRAM 256MB 200MHZ 66TSOP
• Manufacturer: Micron Technology Inc
• Series: -r

Specifications of MT46V16M16P-5B:M

• Format - Memory: RAM
• Memory Type: DDR SDRAM
• Memory Size: 256M (16Mx16)
• Speed: 5ns
• Interface: Parallel
• Voltage - Supply: 2.5 V ~ 2.7 V
• Operating Temperature: 0°C ~ 70°C
• Package / Case: 66-TSOP (0.400", 10.16mm Width)
• Lead Free Status / Rohs Status: Lead free / RoHS Compliant

Figure 40:
Figure 41:
PDF: 09005aef80768abb/Source: 09005aef82a95a3a
DDR_x4x8x16_Core2.fm - 256Mb DDR: Rev. P; Core DDR Rev. D 2/11 EN
Nonconsecutive WRITE-to-WRITE
Random WRITE Cycles
Notes:
Notes:
t DQSS (NOM)
1. DI b (or n) = data-in from column b (or column n).
2. Three subsequent elements of data-in are applied in the programmed order following DI b.
3. Three subsequent elements of data-in are applied in the programmed order following DI n.
4. An uninterrupted burst of 4 is shown.
5. Each WRITE command may be to any bank.
Command
1. DI b (or x or n or a or g) = data-in from column b (or column x, or column n, or column a, or
2. b', x', n', a' or g' indicate the next data-in following DO b, DO x, DO n, DO a, or DO g,
3. Programmed BL = 2, BL = 4, or BL = 8 in cases shown.
4. Each WRITE command may be to any bank.
Address
Command
column g).
respectively.
Address
DQS
CK#
DM
DQ
CK
DQS
CK#
DM
DQ
CK
WRITE
Bank,
Col b
T0
WRITE
Bank,
Col b
T0
t DQSS (NOM)
t DQSS
WRITE
Bank,
Col x
DI
T1
b
NOP
DI
T1
b
75
T1n
DI
b'
T1n
WRITE
Bank,
Col n
Micron Technology, Inc., reserves the right to change products or specifications without notice.
T2
DI
x
NOP
T2
T2n
DI
x'
256Mb: x4, x8, x16 DDR SDRAM
T2n
WRITE
Bank,
Col a
T3
DI
n
WRITE
Bank,
Col n
T3
Transitioning Data
T3n
DI
n'
Transitioning Data
©2000 Micron Technology, Inc. All rights reserved.
WRITE
Bank,
Col g
T4
DI
a
NOP
DI
T4
n
T4n
DI
a'
T4n
Operations
NOP
T5
DI
g
Don’t Care
T5
NOP
Don’t Care
T5n
DI
g'
T5n