PSMN2R2-30YLC,115 NXP Semiconductors, PSMN2R2-30YLC,115 Datasheet - Page 9

MOSFET Power N-Ch 30V 2.15mOhms

PSMN2R2-30YLC,115

Manufacturer Part Number
PSMN2R2-30YLC,115
Description
MOSFET Power N-Ch 30V 2.15mOhms
Manufacturer
NXP Semiconductors
Series
-r
Datasheet

Specifications of PSMN2R2-30YLC,115

Transistor Polarity
N-Channel
Resistance Drain-source Rds (on)
2.15 mOhms
Drain-source Breakdown Voltage
30 V
Gate-source Breakdown Voltage
20 V
Continuous Drain Current
100 A
Power Dissipation
141 W
Maximum Operating Temperature
+ 175 C
Mounting Style
SMD/SMT
Package / Case
LFPAK
Gate Charge Qg
55 nC
Minimum Operating Temperature
- 55 C
Fet Type
MOSFET N-Channel, Metal Oxide
Fet Feature
Logic Level Gate
Rds On (max) @ Id, Vgs
2.15 mOhm @ 25A, 10V
Drain To Source Voltage (vdss)
30V
Current - Continuous Drain (id) @ 25° C
100A
Vgs(th) (max) @ Id
1.95V @ 1mA
Gate Charge (qg) @ Vgs
55nC @ 10V
Input Capacitance (ciss) @ Vds
3310pF @ 15V
Power - Max
141W
Mounting Type
Surface Mount
Lead Free Status / Rohs Status
 Details
Other names
934065191115
NXP Semiconductors
PSMN2R2-30YLC
Product data sheet
Fig 12. Drain-source on-state resistance as a function
Fig 14. Gate charge waveform definitions
(mΩ)
R
DS on
12
10
8
6
4
2
0
of drain current; typical values
0
V
V
V
V
GS(pl)
DS
GS(th)
GS
20
Q
GS1
I
Q
D
GS
40
Q
GS2
2.6
Q
G(tot)
60
Q
GD
N-channel 30 V 2.15mΩ logic level MOSFET in LFPAK using NextPower
V
GS
80
All information provided in this document is subject to legal disclaimers.
003a a f 890
003aaa508
(V) =
I
D
(A)
2.8
3.0
3.5
4.5
10
100
Rev. 02 — 3 May 2011
Fig 13. Normalized drain-source on-state resistance
Fig 15. Gate-source voltage as a function of gate
V
(V)
a
GS
1.5
0.5
10
2
1
0
8
6
4
2
0
-60
factor as a function of junction temperature
charge; typical values
0
0
PSMN2R2-30YLC
20
60
V
GS
V
DS
=10V
15V
40
= 6V
120
24V
Q
© NXP B.V. 2011. All rights reserved.
G
003a a f 891
003a a f 897
T
(nC)
j
(°C)
4.5V
180
60
9 of 15

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