PSMN2R2-30YLC,115 NXP Semiconductors, PSMN2R2-30YLC,115 Datasheet - Page 10

MOSFET Power N-Ch 30V 2.15mOhms

PSMN2R2-30YLC,115

Manufacturer Part Number
PSMN2R2-30YLC,115
Description
MOSFET Power N-Ch 30V 2.15mOhms
Manufacturer
NXP Semiconductors
Series
-r
Datasheet

Specifications of PSMN2R2-30YLC,115

Transistor Polarity
N-Channel
Resistance Drain-source Rds (on)
2.15 mOhms
Drain-source Breakdown Voltage
30 V
Gate-source Breakdown Voltage
20 V
Continuous Drain Current
100 A
Power Dissipation
141 W
Maximum Operating Temperature
+ 175 C
Mounting Style
SMD/SMT
Package / Case
LFPAK
Gate Charge Qg
55 nC
Minimum Operating Temperature
- 55 C
Fet Type
MOSFET N-Channel, Metal Oxide
Fet Feature
Logic Level Gate
Rds On (max) @ Id, Vgs
2.15 mOhm @ 25A, 10V
Drain To Source Voltage (vdss)
30V
Current - Continuous Drain (id) @ 25° C
100A
Vgs(th) (max) @ Id
1.95V @ 1mA
Gate Charge (qg) @ Vgs
55nC @ 10V
Input Capacitance (ciss) @ Vds
3310pF @ 15V
Power - Max
141W
Mounting Type
Surface Mount
Lead Free Status / Rohs Status
 Details
Other names
934065191115
NXP Semiconductors
PSMN2R2-30YLC
Product data sheet
Fig 16. Input, output and reverse transfer capacitances
Fig 18. Reverse recovery timing definition
(pF)
10
C
10
10
4
3
2
10
as a function of drain-source voltage; typical
values
-1
1
10
(A)
I
D
0
N-channel 30 V 2.15mΩ logic level MOSFET in LFPAK using NextPower
V
All information provided in this document is subject to legal disclaimers.
DS
003a a f 895
C
C
C
os s
is s
(V)
rs s
10
2
Rev. 02 — 3 May 2011
t
a
Fig 17. Source current as a function of source-drain
t
rr
(A)
I
100
S
80
60
40
20
t
b
0
voltage; typical values
0
I
RM
003a a f 444
0.25 I
t (s )
R M
0.3
T
PSMN2R2-30YLC
j
= 150°C
0.6
T
0.9
j
= 25 °C
© NXP B.V. 2011. All rights reserved.
003a a f 898
V
S D
(V)
1.2
10 of 15

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