PIC16F631-I/P Microchip Technology Inc., PIC16F631-I/P Datasheet - Page 280

• Manufacturer Part Number: PIC16F631-I/P
• Description: MCU, 8-Bit, 1KW Flash, 64 RAM, 18 I/O, PDIP-20
• Manufacturer: Microchip Technology Inc.

Specifications of PIC16F631-I/P

• Comparators: 2
• Cpu Speed: 5 MIPS
• Eeprom Memory: 128 Bytes
• Input Output: 18
• Memory Type: Flash
• Number Of Bits: 8
• Package Type: 20-pin PDIP
• Programmable Memory: 1.75K Bytes
• Ram Size: 64 Bytes
• Speed: 20 MHz
• Timers: 1-8-bit, 1-16-bit
• Voltage, Range: 2-5.5 V
• Lead Free Status / Rohs Status: RoHS Compliant part Electrostatic Device

PIC16F631/677/685/687/689/690
20-Lead Plastic Shrink Small Outline (SS) – 5.30 mm Body [SSOP]
Notes:
1. Pin 1 visual index feature may vary, but must be located within the hatched area.
2. Dimensions D and E1 do not include mold flash or protrusions. Mold flash or protrusions shall not exceed 0.20 mm per side.
3. Dimensioning and tolerancing per ASME Y14.5M.
DS41262D-page 278
Note:
BSC: Basic Dimension. Theoretically exact value shown without tolerances.
REF: Reference Dimension, usually without tolerance, for information purposes only.
NOTE 1
For the most current package drawings, please see the Microchip Packaging Specification located at
http://www.microchip.com/packaging
A
A1
Number of Pins
Pitch
Overall Height
Molded Package Thickness
Standoff
Overall Width
Molded Package Width
Overall Length
Foot Length
Footprint
Lead Thickness
Foot Angle
Lead Width
N
1 2
b
D
Dimension Limits
e
A2
E1
Units
A2
A1
E1
L1
N
A
E
D
e
L
c
φ
b
E
c
1.65
0.05
7.40
5.00
6.90
0.55
0.09
0.22
MIN
0°
–
L1
MILLIMETERS
0.65 BSC
1.25 REF
NOM
1.75
7.80
5.30
7.20
0.75
20
4°
–
–
–
–
Microchip Technology Drawing C04-072B
© 2007 Microchip Technology Inc.
MAX
2.00
1.85
8.20
5.60
7.50
0.95
0.25
0.38
8°
–
φ
L