PIC16F631-I/P Microchip Technology Inc., PIC16F631-I/P Datasheet - Page 278

• Manufacturer Part Number: PIC16F631-I/P
• Description: MCU, 8-Bit, 1KW Flash, 64 RAM, 18 I/O, PDIP-20
• Manufacturer: Microchip Technology Inc.

Specifications of PIC16F631-I/P

• Comparators: 2
• Cpu Speed: 5 MIPS
• Eeprom Memory: 128 Bytes
• Input Output: 18
• Memory Type: Flash
• Number Of Bits: 8
• Package Type: 20-pin PDIP
• Programmable Memory: 1.75K Bytes
• Ram Size: 64 Bytes
• Speed: 20 MHz
• Timers: 1-8-bit, 1-16-bit
• Voltage, Range: 2-5.5 V
• Lead Free Status / Rohs Status: RoHS Compliant part Electrostatic Device

PIC16F631/677/685/687/689/690
19.2
The following sections give the technical details of the packages.
20-Lead Plastic Dual In-Line (P) – 300 mil Body [PDIP]
Notes:
1. Pin 1 visual index feature may vary, but must be located within the hatched area.
2. § Significant Characteristic.
3. Dimensions D and E1 do not include mold flash or protrusions. Mold flash or protrusions shall not exceed .010" per side.
4. Dimensioning and tolerancing per ASME Y14.5M.
DS41262D-page 276
Note:
NOTE 1
A
A1
BSC: Basic Dimension. Theoretically exact value shown without tolerances.
Package Details
For the most current package drawings, please see the Microchip Packaging Specification located at
http://www.microchip.com/packaging
Number of Pins
Pitch
Top to Seating Plane
Molded Package Thickness
Base to Seating Plane
Shoulder to Shoulder Width
Molded Package Width
Overall Length
Tip to Seating Plane
Lead Thickness
Upper Lead Width
Lower Lead Width
Overall Row Spacing §
N
1
2
b
b1
3
D
Dimension Limits
e
Units
A2
A1
E1
eB
b1
N
A
E
D
e
L
c
b
A2
E1
.115
.015
.300
.240
.980
.115
.008
.045
.014
MIN
–
–
L
.100 BSC
INCHES
1.030
NOM
.310
.250
.130
.010
.060
.018
.130
20
–
–
–
Microchip Technology Drawing C04-019B
© 2007 Microchip Technology Inc.
1.060
MAX
.210
.195
.325
.280
.150
.015
.070
.022
.430
–
eB
E
c