PCX107AVZFU100LC E2V, PCX107AVZFU100LC Datasheet - Page 16

• Manufacturer Part Number: PCX107AVZFU100LC
• Description: IC PCI BRIDGE MEM CTRLR 503PBGA
• Manufacturer: E2V

Specifications of PCX107AVZFU100LC

• Controller Type: PCI Controller
• Interface: PCI
• Voltage - Supply: 2.375 V ~ 2.625 V
• Operating Temperature: -40°C ~ 110°C
• Mounting Type: Surface Mount
• Package / Case: 503-PBGA
• Lead Free Status / RoHS Status: Contains lead / RoHS non-compliant
• Current - Supply: -

6.1.1
Table 6-2.
Notes:
16
Characteristic
Thermal resistance junction to case
Thermal resistance junction to bottom of balls
Thermal resistance junction to board, Jedec JESD51-8 (2s2p board)
Thermal resistance junction to ambient, Jedec JESD51-2
(2s2p board = 2 signals + 2 power planes in board)
1. Nominal values: means computed with nominal geometry and nominal thermal conductivities of materials as given in legend
2. In this case thermal resistance junction to case is thermal resistance junction to top of Silicon die, and value almost not
PC107A
Package Thermal Characteristics for HiTCE
of each simulation results.
depend from substrate used for land grid array. Value depends strongly on heating zone size in Silicon chip assumption. In
present simulations heating zone is 5.8 mm × 3.65 mm that is 42% of die size. Assuming the full die size as uniformly power
dissipating is not realistic.
Assuming 8.3 mm × 5.15 mm heating zone (85% of die surface) leads to 0.15°C/watt instead of 0.29°C/watt.
Package Thermal Characteristics for HiTCE Package
Table 6-2
(2)
provides the package thermal characteristics for the PC107 HiTCE.
(1)
PC107 HiTCE
Value
0.295
15.8
18.4
26.3
2137D–HIREL–08/05
°C/Wat
°C/Watt
°C/Watt
°C/Watt
Unit
t