MC7457RX867NC Freescale Semiconductor, MC7457RX867NC Datasheet - Page 61
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MC7457RX867NC
Manufacturer Part Number
MC7457RX867NC
Description
IC MPU RISC 32BIT 483FCCBGA
Manufacturer
Freescale Semiconductor
Datasheet
1.MC7457VG867NC.pdf
(72 pages)
Specifications of MC7457RX867NC
Processor Type
MPC74xx PowerPC 32-Bit
Speed
867MHz
Voltage
1.1V
Mounting Type
Surface Mount
Package / Case
483-FCCBGA
Family Name
MPC74xx
Device Core
PowerPC
Device Core Size
32b
Frequency (max)
867MHz
Instruction Set Architecture
RISC
Supply Voltage 1 (typ)
1.3/1.5/1.8/2.5V
Operating Supply Voltage (max)
1.35/1.575/2.625V
Operating Supply Voltage (min)
1.25/1.425/1.71V
Operating Temp Range
0C to 105C
Operating Temperature Classification
Commercial
Mounting
Surface Mount
Pin Count
483
Package Type
FCCBGA
Lead Free Status / RoHS Status
Contains lead / RoHS non-compliant
Features
-
Lead Free Status / Rohs Status
Not Compliant
Available stocks
Company
Part Number
Manufacturer
Quantity
Price
Company:
Part Number:
MC7457RX867NC
Manufacturer:
ST
Quantity:
5
Company:
Part Number:
MC7457RX867NC
Manufacturer:
Freescale Semiconductor
Quantity:
10 000
9.8.2
A thermal interface material is recommended at the package lid-to-heat sink interface to minimize the
thermal contact resistance. For those applications where the heat sink is attached by spring clip
mechanism,
(silicone, graphite/oil, floroether oil), a bare joint, and a joint with thermal grease as a function of contact
pressure. As shown, the performance of these thermal interface materials improves with increasing contact
pressure. The use of thermal grease significantly reduces the interface thermal resistance. That is, the bare
joint results in a thermal resistance approximately seven times greater than the thermal grease joint.
Often, heat sinks are attached to the package by means of a spring clip to holes in the printed-circuit board
(see
interface pressure and is recommended due to the high power dissipation of the MPC7457. Of course, the
selection of any thermal interface material depends on many factors—thermal performance requirements,
manufacturability, service temperature, dielectric properties, cost, etc.
The board designer can choose between several types of thermal interface. Heat sink adhesive materials
should be selected based on high conductivity, yet adequate mechanical strength to meet equipment
shock/vibration requirements. There are several commercially available thermal interfaces and adhesive
materials provided by the following vendors:
Freescale Semiconductor
Figure
27). Therefore, the synthetic grease offers the best thermal performance, considering the low
Thermal Interface Materials
Figure 29
1.5
0.5
2
1
0
Figure 29. Thermal Performance of Select Thermal Interface Material
0
shows the thermal performance of three thin-sheet thermal-interface materials
MPC7457 RISC Microprocessor Hardware Specifications, Rev. 7
10
20
Contact Pressure (psi)
30
40
50
Silicone Sheet (0.006 in.)
Bare Joint
Floroether Oil Sheet (0.007 in.)
Graphite/Oil Sheet (0.005 in.)
Synthetic Grease
60
70
System Design Information
80
61