MC7457RX867NC Freescale Semiconductor, MC7457RX867NC Datasheet - Page 59

• Manufacturer Part Number: MC7457RX867NC
• Description: IC MPU RISC 32BIT 483FCCBGA
• Manufacturer: Freescale Semiconductor

Specifications of MC7457RX867NC

• Processor Type: MPC74xx PowerPC 32-Bit
• Speed: 867MHz
• Voltage: 1.1V
• Mounting Type: Surface Mount
• Package / Case: 483-FCCBGA
• Family Name: MPC74xx
• Device Core: PowerPC
• Device Core Size: 32b
• Frequency (max): 867MHz
• Instruction Set Architecture: RISC
• Supply Voltage 1 (typ): 1.3/1.5/1.8/2.5V
• Operating Supply Voltage (max): 1.35/1.575/2.625V
• Operating Supply Voltage (min): 1.25/1.425/1.71V
• Operating Temp Range: 0C to 105C
• Operating Temperature Classification: Commercial
• Mounting: Surface Mount
• Pin Count: 483
• Package Type: FCCBGA
• Lead Free Status / RoHS Status: Contains lead / RoHS non-compliant
• Features: -
• Lead Free Status / Rohs Status: Not Compliant

9.8
This section provides thermal management information for the ceramic ball grid array (CBGA) package
for air-cooled applications. Proper thermal control design is primarily dependent on the system-level
design—the heat sink, airflow, and thermal interface material. To reduce the die-junction temperature, heat
sinks may be attached to the package by several methods—spring clip to holes in the printed-circuit board
or package, and mounting clip and screw assembly (see
mass of the heat sink, attachment through the printed-circuit board is suggested. If a spring clip is used,
the spring force should not exceed 10 pounds.
The board designer can choose between several types of heat sinks to place on the MPC7457. There are
several commercially available heat sinks for the MPC7457 provided by the following vendors:
Freescale Semiconductor
Aavid Thermalloy
80 Commercial St.
Concord, NH 03301
Internet: www.aavidthermalloy.com
Alpha Novatech
473 Sapena Ct. #15
Santa Clara, CA 95054
Internet: www.alphanovatech.com
Calgreg Thermal Solutions
60 Alhambra Road
Warwick, RI 02886
Internet: www.calgregthermalsolutions.com
International Electronic Research Corporation (IERC)
413 North Moss St.
Burbank, CA 91502
Internet: www.ctscorp.com
Thermal Management Information
Figure 27. Package Exploded Cross-Sectional View with Several Heat Sink Options
MPC7457 RISC Microprocessor Hardware Specifications, Rev. 7
Interface Material
Heat Sink
Thermal
Heat Sink
Clip
Printed-Circuit Board
CBGA Package
Figure
408-749-7601
603-224-9988
401-732-8100
818-842-7277
27); however, due to the potential large
System Design Information
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