MC7457RX867NC Freescale Semiconductor, MC7457RX867NC Datasheet - Page 14
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MC7457RX867NC
Manufacturer Part Number
MC7457RX867NC
Description
IC MPU RISC 32BIT 483FCCBGA
Manufacturer
Freescale Semiconductor
Datasheet
1.MC7457VG867NC.pdf
(72 pages)
Specifications of MC7457RX867NC
Processor Type
MPC74xx PowerPC 32-Bit
Speed
867MHz
Voltage
1.1V
Mounting Type
Surface Mount
Package / Case
483-FCCBGA
Family Name
MPC74xx
Device Core
PowerPC
Device Core Size
32b
Frequency (max)
867MHz
Instruction Set Architecture
RISC
Supply Voltage 1 (typ)
1.3/1.5/1.8/2.5V
Operating Supply Voltage (max)
1.35/1.575/2.625V
Operating Supply Voltage (min)
1.25/1.425/1.71V
Operating Temp Range
0C to 105C
Operating Temperature Classification
Commercial
Mounting
Surface Mount
Pin Count
483
Package Type
FCCBGA
Lead Free Status / RoHS Status
Contains lead / RoHS non-compliant
Features
-
Lead Free Status / Rohs Status
Not Compliant
Available stocks
Company
Part Number
Manufacturer
Quantity
Price
Company:
Part Number:
MC7457RX867NC
Manufacturer:
ST
Quantity:
5
Company:
Part Number:
MC7457RX867NC
Manufacturer:
Freescale Semiconductor
Quantity:
10 000
Electrical and Thermal Characteristics
Table 6
14
At recommended operating conditions. See
Coefficient of thermal expansion
Notes:
1. Refer to
2. Junction temperature is a function of on-chip power dissipation, package thermal resistance, mounting site (board)
3. Per SEMI G38-87 and JEDEC JESD51-2 with the single-layer board horizontal.
4. Per JEDEC JESD51-6 with the board horizontal.
5. Thermal resistance between the die and the printed-circuit board per JEDEC JESD51-8. Board temperature is measured on
6. Thermal resistance between the die and the case top surface as measured by the cold plate method (MIL SPEC-883 Method
Input high voltage
(all inputs including SYSCLK)
Input low voltage
(all inputs including SYSCLK)
Input leakage current, V
High-impedance (off-state) leakage
current, V
Output high voltage, I
Output low voltage, I
temperature, ambient temperature, airflow, power dissipation of other components on the board, and board thermal
resistance.
the top surface of the board near the package.
1012.1) with the calculated case temperature. The actual value of R
provides the DC electrical characteristics for the MPC7457.
in
Section 9.8, “Thermal Management Information,”
= GV
Characteristic
DD
/OV
OL
OH
Characteristic
DD
= 5 mA
in
= –5 mA
= GV
MPC7457 RISC Microprocessor Hardware Specifications, Rev. 7
Table 5. Package Thermal Characteristics
DD
/OV
DD
Table
Table 6. DC Electrical Specifications
Voltage
Nominal
4.
Bus
1.5
1.8
2.5
1.5
1.8
2.5
1.5
1.8
2.5
1.5
1.8
2.5
—
—
1
Symbol
V
V
V
I
V
TSI
I
OH
OL
in
IH
IL
for more details about thermal management.
Symbol
OV
OV
OV
GV
DD
DD
DD
θJC
/GV
/GV
/GV
DD
–0.3
–0.3
–0.3
Min
1.7
1.8
—
—
—
—
—
for the part is less than 0.1°C/W.
DD
DD
DD
× 0.65
MPC7447
× 0.65
– 0.45
– 0.45
1
6.8
(continued)
Value
OV
OV
OV
DD
GV
GV
DD
DD
MPC7457
/GV
DD
/GV
/GV
DD
Max
0.45
0.45
6.8
0.7
0.6
30
30
—
—
—
× 0.35
DD
+ 0.3
DD
DD
× 0.35
Freescale Semiconductor
+ 0.3
+ 0.3
ppm/°C
Unit
Unit
µA
µA
V
V
V
V
V
V
V
V
V
V
V
V
Notes
Notes
2, 3, 4
2, 6
2, 3
2
6
6