MC7457RX867NC Freescale Semiconductor, MC7457RX867NC Datasheet - Page 10

• Manufacturer Part Number: MC7457RX867NC
• Description: IC MPU RISC 32BIT 483FCCBGA
• Manufacturer: Freescale Semiconductor

Specifications of MC7457RX867NC

• Processor Type: MPC74xx PowerPC 32-Bit
• Speed: 867MHz
• Voltage: 1.1V
• Mounting Type: Surface Mount
• Package / Case: 483-FCCBGA
• Family Name: MPC74xx
• Device Core: PowerPC
• Device Core Size: 32b
• Frequency (max): 867MHz
• Instruction Set Architecture: RISC
• Supply Voltage 1 (typ): 1.3/1.5/1.8/2.5V
• Operating Supply Voltage (max): 1.35/1.575/2.625V
• Operating Supply Voltage (min): 1.25/1.425/1.71V
• Operating Temp Range: 0C to 105C
• Operating Temperature Classification: Commercial
• Mounting: Surface Mount
• Pin Count: 483
• Package Type: FCCBGA
• Lead Free Status / RoHS Status: Contains lead / RoHS non-compliant
• Features: -
• Lead Free Status / Rohs Status: Not Compliant

General Parameters
4
The following list provides a summary of the general parameters of the MPC7457:
5
This section provides the AC and DC electrical specifications and thermal characteristics for the
MPC7457.
5.1
The tables in this section describe the MPC7457 DC electrical
absolute maximum ratings.
10
Cache level
Total SRAM space supported
On-chip tag logical size (cache space)
Associativity
Number of 32-byte sectors/line
Off-Chip data SRAM support
Data path width
Direct mapped SRAM sizes
Parity
Notes:
1. Not implemented on MPC7447, MPC7445, or MPC7441.
2. The MPC7457 supports up to 4 MB of SRAM, of which a maximum of 2 MB can be configured as cache memory; the
remaining 2 MB may be unused or configured as private memory.
General Parameters
Technology
Die size
Transistor count
Logic design
Packages
Core power supply
I/O power supply
Electrical and Thermal Characteristics
Microarchitectural Specs
DC Electrical Characteristics
MPC7457 RISC Microprocessor Hardware Specifications, Rev. 7
Table 1. Microarchitecture Comparison (continued)
0.13 μm CMOS, nine-layer metal
9.1 mm
58 million
Fully-static
MPC7447: Surface mount 360 ceramic ball grid array (CBGA)
MPC7457: Surface mount 483 ceramic ball grid array (CBGA)
1.3 V ±50 mV DC nominal
1.8 V ±5% DC, or
2.5 V ±5% DC, or
1.5 V ±5% DC (L3 interface only, not implemented on MPC7447)
MSUG2 DDR, LW, PB2
MPC7457/MPC7447
1 MB, 2MB, 4 MB
1 MB, 2 MB, 4 MB
×
10.8 mm
1 MB, 2 MB
8-way
Byte
2, 4
L3
64
2
MSUG2 DDR, LW, PB2
MPC7455/MPC7445
characteristics.Table 2
1 MB, 2 MB
1 MB, 2 MB
1 MB, 2 MB
8-way
Byte
2, 4
L3
64
Freescale Semiconductor
MSUG2 DDR, LW, PB2
MPC7450/MPC7451/
provides the
1 MB, 2 MB
1 MB, 2 MB
1 MB, 2 MB
MPC7441
8-way
Byte
2, 4
L3
64