MC68040FE25A Freescale Semiconductor, MC68040FE25A Datasheet - Page 341
![no-image](/images/manufacturer_photos/0/2/262/freescale_semiconductor_sml.jpg)
MC68040FE25A
Manufacturer Part Number
MC68040FE25A
Description
IC MICROPROCESSOR 32BIT 184-CQFP
Manufacturer
Freescale Semiconductor
Datasheet
1.MC68EC040FE33A.pdf
(442 pages)
Specifications of MC68040FE25A
Processor Type
M680x0 32-Bit
Speed
25MHz
Voltage
5V
Mounting Type
Surface Mount
Package / Case
184-CQFP
Family Name
M68000
Device Core
ColdFire
Device Core Size
32b
Frequency (max)
25MHz
Instruction Set Architecture
RISC
Operating Temp Range
0C to 70C
Operating Temperature Classification
Commercial
Mounting
Surface Mount
Pin Count
184
Package Type
CQFP
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Features
-
Lead Free Status / Rohs Status
Compliant
Available stocks
Company
Part Number
Manufacturer
Quantity
Price
Company:
Part Number:
MC68040FE25A
Manufacturer:
Freescale Semiconductor
Quantity:
10 000
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rated at a particular maximum operating frequency is dependent upon the power-up
mode. Therefore, the MC68040 is rated at a maximum power dissipation for either the
large or small buffers at a particular frequency. This allows for control of some of the
thermal management upon reset. The following equation provides a rough method to
calculate the maximum power consumption for a chosen output buffer mode:
Table 11-1 lists the simplified relationship on the maximum power dissipation for eight
possible configurations of output buffer modes.
To calculate the specific power dissipation of a design, the termination method of each
signal must be considered. For example, a signal output that is not connected would not
dissipate any additional power if it were configured in the large rather than the small buffer
mode. Since the maximum operating junction temperature is specified as 110 C, the
maximum case temperature (T
where:
MOTOROLA
where:
PINS
PINS
P
*The MC68LC040 and MC68EC040 only utilize this row of information.
T
T
JC
C
D
J
P
P
DSB
CLB
DLB
= Maximum Case Temperature
= Maximum Junction Temperature
= Maximum Power Dissipation of the Device
= Thermal Resistance between the Junction of the Die and the Case
P
Data Bus
LB
Small*
D
Small
Small
Small
Large
Large
Large
Large
= Maximum Power Dissipation for Output Buffer Mode Selected
= Maximum Power Dissipation for Small Buffer Mode (All Outputs)
= Maximum Power Dissipation for Large Buffer Mode (All Outputs)
= Number of Pins Large Buffer Mode
= Number of Pins Capable of the Large Buffer Mode
P
D
Table 11-1. Maximum Power Dissipation for
Transfer Attributes
Output Configuration
Address Bus and
= P
Freescale Semiconductor, Inc.
For More Information On This Product,
Output Buffer Mode Configurations
DSB
Small
Large
Large
Small
Small
Large
Large
Small
C
+ (P
) in C can be obtained from the following equation:
Go to: www.freescale.com
M68040 USER’S MANUAL
DLB
T
C
= T
– P
DSB
J
Control Signals
– P
)
Small
Large
Small
Large
Small
Large
Small
Large
D
( PINS
JC
LB
P
P
P
P
P
P
P
P
DSB
DSB
DSB
DSB
DSB
DSB
DSB
DSB
PINS
Maximum Power Dissipation
+ (P
+ (P
+ (P
+ (P
+ (P
+ (P
+ (P
CLB
DLB
DLB
DLB
DLB
DLB
DLB
DLB
)
– P
– P
– P
– P
– P
– P
– P
DSB
DSB
DSB
DSB
DSB
DSB
DSB
)
)
)
)
)
)
)
13%
52%
65%
35%
87%
48%
100%
11-13
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