MPC850DSLZQ50BU Freescale Semiconductor, MPC850DSLZQ50BU Datasheet - Page 8

• Manufacturer Part Number: MPC850DSLZQ50BU
• Description: IC MPU PWRQUICC 50MHZ 256-PBGA
• Manufacturer: Freescale Semiconductor

Specifications of MPC850DSLZQ50BU

• Processor Type: MPC8xx PowerQUICC 32-Bit
• Speed: 50MHz
• Voltage: 3.3V
• Mounting Type: Surface Mount
• Package / Case: 256-PBGA
• Family Name: MPC8xx
• Device Core: PowerQUICC
• Device Core Size: 32b
• Frequency (max): 50MHz
• Instruction Set Architecture: RISC
• Supply Voltage 1 (typ): 3.3V
• Operating Supply Voltage (max): 3.465V
• Operating Supply Voltage (min): 3.135V
• Operating Temp Range: 0C to 95C
• Operating Temperature Classification: Commercial
• Mounting: Surface Mount
• Pin Count: 256
• Package Type: BGA
• Lead Free Status / RoHS Status: Contains lead / RoHS non-compliant
• Features: -
• Lead Free Status / Rohs Status: Not Compliant

Thermal Characteristics
4
Table 3
Table 4
Table 5
8
Operating voltage at 40 MHz or less
Operating voltage at 40 MHz or higher
Input high voltage (address bus, data bus, EXTAL, EXTCLK,
and all bus control/status signals)
Input high voltage (all general purpose I/O and peripheral pins)
1
2
3
4
temperature rise of 13°C above ambient.
T
P
Thermal resistance for BGA
Thermal Resistance for BGA (junction-to-case)
Thermal Characteristics
J
shows the thermal characteristics for the MPC850.
Assumes natural convection and a single layer board (no thermal vias).
Assumes natural convection, a multilayer board with thermal vias
I/O
provides power dissipation information.
provides the DC electrical characteristics for the MPC850.
general, refer to AN-1231/D, Plastic Ball Grid Array Application Note available from your local Freescale sales
office.
temperature rise of 20°C above ambient.
= T
P
where:
For more information on the design of thermal vias on multilayer boards and BGA layout considerations in
Assumes natural convection, a multilayer board with thermal vias
MPC850 PowerQUICC™ Integrated Communications Processor Hardware Specifications, Rev. 2
D
is the power dissipation on pins
A
= (V
+ (P
DD
1
2
D
Power Dissipation
All Revisions
(1:1) Mode
•
•
Typical power dissipation is measured at 3.3V
Maximum power dissipation is measured at 3.65 V
I
θ
DD
JA
Characteristic
) + P
)
Characteristic
Characteristic
I/O
1
Table 5. DC Electrical Specifications
Table 3. Thermal Characteristics
Table 4. Power Dissipation (P
Frequency (MHz)
33
40
50
KAPWR, VDDSYN
KAPWR, VDDSYN
Typical
Symbol
VDDH, VDDL,
VDDH, VDDL,
TBD
TBD
TBD
θ
θ
θ
θ
JA
JA
JA
JC
Symbol
4
, 1 watt MPC850 dissipation, and a board
4
VIH
VIH
, 1 watt MPC850 dissipation, and a board
1
D
)
Maximum
515
590
725
Value
40
24
31
8
2
4
3
3.135
2
Min
3.0
2.0
2.0
Unit
mW
mW
mW
Freescale Semiconductor
3.465
Max
3.6
3.6
5.5
°C/W
°C/W
°C/W
°C/W
Unit
Unit
V
V
V
V