MPC755CRX400LE Freescale Semiconductor, MPC755CRX400LE Datasheet - Page 34

IC MPU 32BIT 400MHZ PPC 360-CBGA

MPC755CRX400LE

Manufacturer Part Number
MPC755CRX400LE
Description
IC MPU 32BIT 400MHZ PPC 360-CBGA
Manufacturer
Freescale Semiconductor
Datasheet

Specifications of MPC755CRX400LE

Processor Type
MPC7xx PowerPC 32-Bit
Speed
400MHz
Voltage
2V
Mounting Type
Surface Mount
Package / Case
360-FCCBGA
Family Name
MPC7xx
Device Core
PowerPC
Device Core Size
64b
Frequency (max)
400MHz
Instruction Set Architecture
RISC
Supply Voltage 1 (typ)
2V
Operating Supply Voltage (max)
2.1V
Operating Supply Voltage (min)
1.9V
Operating Temp Range
0C to 105C
Operating Temperature Classification
Commercial
Mounting
Surface Mount
Pin Count
360
Package Type
FCCBGA
Lead Free Status / RoHS Status
Contains lead / RoHS non-compliant
Features
-
Lead Free Status / Rohs Status
Not Compliant

Available stocks

Company
Part Number
Manufacturer
Quantity
Price
Part Number:
MPC755CRX400LE
Manufacturer:
MOT
Quantity:
12 388
Part Number:
MPC755CRX400LE
Manufacturer:
Freescale Semiconductor
Quantity:
10 000
Package Description
7.3
The package parameters are as provided in the following list. The package type is 25 × 25 mm, 360-lead
ceramic ball grid array (CBGA).
7.4
Figure 19
360 CBGA package.
34
2X
A1 CORNER
0.2
Package outline
Interconnects
Pitch
Minimum module height
Maximum module height
Ball diameter
Package Parameters for the MPC755 CBGA
Mechanical Dimensions for the MPC755 CBGA
Figure 19. Mechanical Dimensions and Bottom Surface Nomenclature for the MPC755,
provides the mechanical dimensions and bottom surface nomenclature for the MPC755,
e
E
E1
1 2 3 4 5 6 7 8 9 10 111213141516
MPC755 RISC Microprocessor Hardware Specifications, Rev. 8
360X
D1
D
b
360 (19 × 19 ball array – 1)
1.27 mm (50 mil)
2.65 mm
3.20 mm
25 × 25 mm
0.89 mm (35 mil)
0.15
0.3
171819
360 CBGA Package
2X
C
C
A
0.2
A
W
B
V
U
R
N
M
K
H
G
D
C
B
A
T
P
L
J
F
E
0.2 C
A
A3
A2
A1
C
NOTES:
1. DIMENSIONING AND TOLERANCING
2. DIMENSIONS IN MILLIMETERS.
3. TOP SIDE A1 CORNER INDEX IS A
PER ASME Y14.5M, 1994.
METALIZED FEATURE WITH VARIOUS
SHAPES. BOTTOM SIDE A1 CORNER
IS DESIGNATED WITH A BALL MISSING
FROM THE ARRAY.
DIM
A1
A2
A3
D1
E1
A
D
b
E
e
Freescale Semiconductor
2.65
0.79
1.10
0.82
Min
Millimeters
25.00 BSC
25.00 BSC
1.27 BSC
6.75
7.87
Max
3.20
0.99
1.30
0.60
0.93

Related parts for MPC755CRX400LE