MPC8308VMAGD Freescale Semiconductor, MPC8308VMAGD Datasheet - Page 63

• Manufacturer Part Number: MPC8308VMAGD
• Description: MPU POWERQUICC II PRO 473MAPBGA
• Manufacturer: Freescale Semiconductor

Specifications of MPC8308VMAGD

• Processor Type: MPC83xx PowerQUICC II Pro 32-Bit
• Speed: 400MHz
• Voltage: 1V
• Mounting Type: Surface Mount
• Package / Case: 473-MAPBGA
• Product: Network Processor
• Data Rate: 256 bps
• Frequency: 400 MHz
• Supply Voltage (max): 3.6 V
• Supply Voltage (min): 3 V
• Supply Current (max): 5 uA
• Maximum Operating Temperature: + 105 C
• Minimum Operating Temperature: 0 C
• Interface: I2C, JTAG, SPI
• Mounting Style: SMD/SMT
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• Features: -
• Lead Free Status / Rohs Status: Lead free / RoHS Compliant

Figure 50
Figure 51
20 Package and Pin Listings
This section details package parameters, pin assignments, and dimensions. The MPC8308 is available in
a moulded array process ball grid array (MAPBGA). For information on the MAPBGA, see
“Package Parameters for the MPC8308 MAPBGA,”
MPC8308 MAPBGA.”
20.1
The package parameters are as provided in the following list. The package type is 19 mm × 19 mm, 473
MAPBGA.
Freescale Semiconductor
Package outline
Interconnects
Pitch
Module height (typical)
Solder Balls
Ball diameter (typical)
Note: The clock edge is selectable on SPI.
Note: The clock edge is selectable on SPI.
Package Parameters for the MPC8308 MAPBGA
SPICLK (output)
shows the SPI timing in slave mode (external clock).
shows the SPI timing in master mode (internal clock).
Output Signals:
Output Signals:
SPICLK (input)
Input Signals:
Input Signals:
(See Note)
(See Note)
(See Note)
(See Note)
SPIMOSI
SPIMISO
SPIMISO
SPIMOSI
Figure 51. SPI AC Timing in Master Mode (Internal Clock) Diagram
Figure 50. SPI AC Timing in Slave Mode (External Clock) Diagram
MPC8308 PowerQUICC II Pro Processor Hardware Specification, Rev. 2
t
NEIVKH
t
NIIVKH
t
NIKHOV
473
0.80 mm
1.39 mm
96.5 Sn/ 3.5Ag
0.40 mm
19 mm × 19 mm
t
NIIXKH
t
NEKHOV
t
NEIXKH
and
Section 20.2, “Mechanical Dimensions of the
Package and Pin Listings
Section 20.1,
63