STPCI2GDYI STMicroelectronics, STPCI2GDYI Datasheet - Page 72

• Manufacturer Part Number: STPCI2GDYI
• Description: IC SYSTEM-ON-CHIP X86 516-PBGA
• Manufacturer: STMicroelectronics

Specifications of STPCI2GDYI

• Applications: Graphics Controller
• Core Processor: x86
• Controller Series: STPC® Atlas
• Interface: UART
• Number Of I /o: 16
• Voltage - Supply: 2.45 V ~ 2.7 V
• Operating Temperature: -40°C ~ 115°C
• Mounting Type: Surface Mount
• Package / Case: 516-PBGA
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• Program Memory Type: -
• Ram Size: -
• Lead Free Status / Rohs Status: Compliant

STPC® ATLAS
5.3. SOLDERING RECOMMENDATIONS
High quality, low defect soldering requires
identifying the optimum temperature profile for
reflowing the solder paste, therefore optimizing the
process. The heating and cooling rise rates must
be compatible with the solder paste and
components. A typical profile consists of a
preheat, dryout, reflow and cooling sections.
The most critical parameter in the preheat
section is to minimize the rate of temperature rise
to less than 2°C / second, in order to minimize
thermal
components.
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1
Figure 5-7. Reflow soldering temperature range
250
200
150
100
50
0
Temperature (
0
shock
PREHEAT
°
C )
on
the
semi-conductor
DRYOUT
Dryout section is used primarily to ensure that
the solder paste is fully dried before hitting reflow
temperatures.
Solder reflow is accomplished in the reflow zone,
where the solder paste is elevated to a
temperature greater than the melting point of the
solder. Melting temperature must be exceeded by
approximately 20°C to ensure quality reflow.
In reality the profile is not a line, but rather a range
of temperatures all solder joints must be
exposed. The total temperature deviation from
component thermal mismatch, oven loading and
oven uniformity must be within the band.
REFLOW
240
COOLING
Time ( s )