STPCI2GDYI STMicroelectronics, STPCI2GDYI Datasheet - Page 102

• Manufacturer Part Number: STPCI2GDYI
• Description: IC SYSTEM-ON-CHIP X86 516-PBGA
• Manufacturer: STMicroelectronics

Specifications of STPCI2GDYI

• Applications: Graphics Controller
• Core Processor: x86
• Controller Series: STPC® Atlas
• Interface: UART
• Number Of I /o: 16
• Voltage - Supply: 2.45 V ~ 2.7 V
• Operating Temperature: -40°C ~ 115°C
• Mounting Type: Surface Mount
• Package / Case: 516-PBGA
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• Program Memory Type: -
• Ram Size: -
• Lead Free Status / Rohs Status: Compliant

STPC® ATLAS
As the PCB acts as a heat sink, the layout of top
and ground layers must be done with care to
maximize the board surface dissipating the heat.
The only limitation is the risk of losing routing
channels.
102/108
Figure 6-36. Layout for Good Thermal Dissipation - top layer
A
1
Figure 6-36
and
Figure 6-37
STPC ball
Via
Not Connected ball
show a
routing with a good thermal dissipation thanks to
an optimized placement of power and signal vias.
The ground plane should be on bottom layer for
the best heat spreading (thicker layer than internal
ones) and dissipation (direct contact with air). .
GND ball
3.3V ball
2.5V ball (Core / PLLs)