EPF6016TC144-3 Altera, EPF6016TC144-3 Datasheet - Page 25

• Manufacturer Part Number: EPF6016TC144-3
• Description: IC FLEX 6000 FPGA 16K 144-TQFP
• Manufacturer: Altera
• Series: FLEX 6000r

Specifications of EPF6016TC144-3

• Number Of Logic Elements/cells: 1320
• Number Of Labs/clbs: 132
• Number Of I /o: 117
• Number Of Gates: 16000
• Voltage - Supply: 4.75 V ~ 5.25 V
• Mounting Type: Surface Mount
• Operating Temperature: 0°C ~ 85°C
• Package / Case: 144-TQFP, 144-VQFP
• Lead Free Status / RoHS Status: Contains lead / RoHS non-compliant
• Total Ram Bits: -
• Other names: 544-1282

Figure 14. IOE Connection to Column Interconnect
SameFrame
Pin-Outs
Altera Corporation
Any LE can drive a
pin through the row
and local interconnect.
FastFLEX I/O: An
LE can drive a
pin through a local
interconnect for faster
clock-to-output times.
3.3-V FLEX 6000 devices support the SameFrame pin-out feature for
FineLine BGA packages. The SameFrame pin-out feature is the
arrangement of balls on FineLine BGA packages such that the lower-ball-
count packages form a subset of the higher-ball-count packages.
SameFrame pin-outs provide the flexibility to migrate not only from
device to device within the same package, but also from one package to
another. A given printed circuit board (PCB) layout can support multiple
device density/package combinations. For example, a single board layout
can support an EPF6016A device in a 100-pin FineLine BGA package or an
EPF6024A device in a 256-pin FineLine BGA package.
The Altera software packages provide support to design PCBs with
SameFrame pin-out devices. Devices can be defined for present and future
use. The Altera software packages generate pin-outs describing how to lay
out a board to take advantage of this migration (see
Row Interconnect
IOE
Each IOE can drive two
column interconnect channels.
Each IOE data and OE signal is
driven to a local interconnect.
FLEX 6000 Programmable Logic Device Family Data Sheet
LAB
IOE
Column Interconnect
Figure
15).
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