SC16C2550BIBS NXP Semiconductors, SC16C2550BIBS Datasheet - Page 43
![](/photos/31/32/313217/sot617-1_sml.jpg)
SC16C2550BIBS
Manufacturer Part Number
SC16C2550BIBS
Description
Manufacturer
NXP Semiconductors
Datasheet
1.SC16C2550BIBS.pdf
(43 pages)
Specifications of SC16C2550BIBS
Number Of Channels
2
Transmit Fifo
16Byte
Receive Fifo
16Byte
Transmitter And Receiver Fifo Counter
Yes
Data Rate
5Mbps
Operating Supply Voltage (max)
5.5V
Mounting
Surface Mount
Pin Count
32
Operating Temperature (min)
-40C
Operating Temperature (max)
85C
Operating Temperature Classification
Industrial
Lead Free Status / Rohs Status
Compliant
Available stocks
Company
Part Number
Manufacturer
Quantity
Price
Company:
Part Number:
SC16C2550BIBS,151
Manufacturer:
NXP
Quantity:
1 861
NXP Semiconductors
18. Contents
1
2
3
3.1
4
5
5.1
5.2
6
6.1
6.2
6.3
6.4
6.5
6.6
6.7
7
7.1
7.2
7.2.1
7.2.2
7.3
7.3.1
7.3.1.1
7.3.1.2
7.3.2
7.4
7.5
7.6
7.7
7.8
7.9
7.10
8
9
10
10.1
11
12
12.1
12.2
12.3
General description . . . . . . . . . . . . . . . . . . . . . . 1
Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1
Ordering information . . . . . . . . . . . . . . . . . . . . . 2
Block diagram . . . . . . . . . . . . . . . . . . . . . . . . . . 3
Pinning information . . . . . . . . . . . . . . . . . . . . . . 4
Functional description . . . . . . . . . . . . . . . . . . . 9
Register descriptions . . . . . . . . . . . . . . . . . . . 15
Limiting values. . . . . . . . . . . . . . . . . . . . . . . . . 25
Static characteristics. . . . . . . . . . . . . . . . . . . . 25
Dynamic characteristics . . . . . . . . . . . . . . . . . 26
Package outline . . . . . . . . . . . . . . . . . . . . . . . . 33
Soldering of SMD packages . . . . . . . . . . . . . . 37
Ordering options . . . . . . . . . . . . . . . . . . . . . . . . 2
Pinning . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4
Pin description . . . . . . . . . . . . . . . . . . . . . . . . . 6
UART A-B functions . . . . . . . . . . . . . . . . . . . . . 9
Internal registers. . . . . . . . . . . . . . . . . . . . . . . 10
FIFO operation . . . . . . . . . . . . . . . . . . . . . . . . 11
Hardware/software and time-out interrupts. . . 11
Programmable baud rate generator . . . . . . . . 12
DMA operation . . . . . . . . . . . . . . . . . . . . . . . . 13
Loopback mode . . . . . . . . . . . . . . . . . . . . . . . 13
Transmit Holding Register (THR) and Receive
Holding Register (RHR) . . . . . . . . . . . . . . . . . 15
Interrupt Enable Register (IER) . . . . . . . . . . . 16
IER versus Transmit/Receive FIFO interrupt
mode operation. . . . . . . . . . . . . . . . . . . . . . . . 17
IER versus Receive/Transmit FIFO polled
mode operation. . . . . . . . . . . . . . . . . . . . . . . . 17
FIFO Control Register (FCR) . . . . . . . . . . . . . 17
DMA mode . . . . . . . . . . . . . . . . . . . . . . . . . . . 17
Mode 0 (FCR bit 3 = 0) . . . . . . . . . . . . . . . . . . 17
Mode 1 (FCR bit 3 = 1) . . . . . . . . . . . . . . . . . . 17
FIFO mode . . . . . . . . . . . . . . . . . . . . . . . . . . . 18
Interrupt Status Register (ISR) . . . . . . . . . . . . 19
Line Control Register (LCR) . . . . . . . . . . . . . . 20
Modem Control Register (MCR) . . . . . . . . . . . 21
Line Status Register (LSR) . . . . . . . . . . . . . . . 22
Modem Status Register (MSR). . . . . . . . . . . . 23
Scratchpad Register (SPR) . . . . . . . . . . . . . . 24
SC16C2550B external reset condition . . . . . . 24
Timing diagrams . . . . . . . . . . . . . . . . . . . . . . . 27
Introduction to soldering . . . . . . . . . . . . . . . . . 37
Wave and reflow soldering . . . . . . . . . . . . . . . 37
Wave soldering . . . . . . . . . . . . . . . . . . . . . . . . 37
5 V, 3.3 V and 2.5 V dual UART, 5 Mbit/s (max.), with 16-byte FIFOs
12.4
13
13.1
13.2
13.3
13.4
14
15
16
16.1
16.2
16.3
16.4
17
18
Please be aware that important notices concerning this document and the product(s)
described herein, have been included in section ‘Legal information’.
© NXP B.V. 2009.
For more information, please visit: http://www.nxp.com
For sales office addresses, please send an email to: salesaddresses@nxp.com
Soldering of through-hole mount packages . 39
Abbreviations . . . . . . . . . . . . . . . . . . . . . . . . . 40
Revision history . . . . . . . . . . . . . . . . . . . . . . . 41
Legal information . . . . . . . . . . . . . . . . . . . . . . 42
Contact information . . . . . . . . . . . . . . . . . . . . 42
Contents. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 43
Reflow soldering. . . . . . . . . . . . . . . . . . . . . . . 38
Introduction to soldering through-hole mount
packages . . . . . . . . . . . . . . . . . . . . . . . . . . . . 39
Soldering by dipping or by solder wave . . . . . 39
Manual soldering . . . . . . . . . . . . . . . . . . . . . . 39
Package related soldering information . . . . . . 40
Data sheet status . . . . . . . . . . . . . . . . . . . . . . 42
Definitions . . . . . . . . . . . . . . . . . . . . . . . . . . . 42
Disclaimers. . . . . . . . . . . . . . . . . . . . . . . . . . . 42
Trademarks . . . . . . . . . . . . . . . . . . . . . . . . . . 42
SC16C2550B
Document identifier: SC16C2550B_5
Date of release: 12 January 2009
All rights reserved.