SC16C2550BIBS NXP Semiconductors, SC16C2550BIBS Datasheet - Page 40

• Manufacturer Part Number: SC16C2550BIBS
• Manufacturer: NXP Semiconductors

Specifications of SC16C2550BIBS

• Number Of Channels: 2
• Transmit Fifo: 16Byte
• Receive Fifo: 16Byte
• Transmitter And Receiver Fifo Counter: Yes
• Data Rate: 5Mbps
• Operating Supply Voltage (max): 5.5V
• Mounting: Surface Mount
• Pin Count: 32
• Operating Temperature (min): -40C
• Operating Temperature (max): 85C
• Operating Temperature Classification: Industrial
• Lead Free Status / Rohs Status: Compliant

NXP Semiconductors
14. Abbreviations
SC16C2550B_5
Product data sheet
13.4 Package related soldering information
Table 28.
[1]
[2]
Table 29.
Package
CPGA, HCPGA
DBS, DIP, HDIP, RDBS, SDIP, SIL
PMFP
Acronym
CPU
DLL
DLM
DMA
FIFO
ISDN
LSB
MSB
RHR
THR
TTL
UART
For SDIP packages, the longitudinal axis must be parallel to the transport direction of the printed-circuit
board.
For PMFP packages hot bar soldering or manual soldering is suitable.
[2]
Suitability of through-hole mount IC packages for dipping and wave soldering
Abbreviations
Description
Central Processing Unit
Divisor Latch LSB
Divisor Latch MSB
Direct Memory Access
First In/First Out
Integrated Service Digital Network
Least Significant Bit
Most Significant Bit
Receive Holding Register
Transmit Holding Register
Transistor-Transistor Logic
Universal Asynchronous Receiver/Transmitter
5 V, 3.3 V and 2.5 V dual UART, 5 Mbit/s (max.), with 16-byte FIFOs
Rev. 05 — 12 January 2009
Soldering method
Dipping
-
suitable
-
SC16C2550B
Wave
suitable
suitable
not suitable
© NXP B.V. 2009. All rights reserved.
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